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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions. |
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Thermal Module (Type II) for BTX
Material: Frame, Impeller, Dust: Plastics Dust seal: Rubber sponge ; Heatsink: Aluminium(Core: Copper)
Life Expectancy: 40,000 hours, indoor environment (Survival rate: 90% at 60, rated voltage, and continuously run in a free air state)
Motor Protection System: Current blocking function and Reverse polarity protection
Dielectric Strength: 50/60Hz, 500VAC, 1 minute(between lead conductor and frame)
Operating Thermally Range: 0 to 70°C (Non-condensing)
Connector: Molex P/N 47054-1000 or Wieson 2510C888-001
Contact: Molex P/N 5159PBT or Equivalent or Wieson 2511-T1
For Intel 775-land LGA Package
Material: Frame,impeller: resin mold; Heatsink:aluminium(Core:copper)
Life Expectancy: 40,000 hours, indoor environment (Survival rate: 90% at 60, rated voltage, and continuously run in a free air state)
Motor Protection System: Current blocking function (with reverse polarity protection)
Dielectric Strength: 50/60Hz, 500VAC, 1 minute (between lead conductor and frame)
Operating Thermally Range: 0 to 70°C (non-condensing)
Connector: Molex P/N 47054-1000 or Wieson 2510C888-001
Contact: Molex P/N 5159PBT or Equivalent or Wieson 2511-T1
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions. |
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Samsung’s MCP portfolio leverages the company’s expertise in memory design and semiconductor process technologies. Its MCPs are built using its lowpower memory technology so that mobile devices will consume as little power as possible. In addition, Samsung’s core MCP technology utilizes the company’s skills in wafer thinning, same-die stacking, wire bonding – chip to chip and long-wire bonding – and molding.
The memory chips included in Samsung MCPs are built using advanced process technologies – from 90 to 65 nanometers. The company’s ongoing investments in fabs and technology assure customers of MCPs that will stay on the leading edge.
One of the many advantages of Samsung MCPs is the consistent use of the
same packaging and footprint, which makes it easy to scale between different Samsung MCP combinations. In addition, Samsung customers are assured of broad options within the same footprint.
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HPA Conformal Coating
Ref: HPA
Resistant to mould growth
May be removed with solvents such as Ultrasolve (ULS)
UV trace for inspection
Excellent dielectric properties and with a wide temperature range
Approved to US MIL-1-46058C
China Military Approval GJB150 and GJB4 (Naval)
For professional use only
Acrylic Protective Lacquer
Ref: APL
Offers excellent adhesion to all substrates
UV trace for inspection
May be removed with solvents such as Ultrasolve (ULS)
Wide temperature range and good dielectric properties
May be soldered through, allowing for repair
For professional use only
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* 30 Series Sub-miniature D.I.L. Relays 1.25 A.
* 32 Series Miniature P.C.B. Relays 6 A
* 34 Series Ultra-slim, P.C.B. Relays 6 A
* 34 Series Ultra-slim, P.C.B. Relays 0.1 - 2 A
* 36 Series Miniature P.C.B. Relays 10 A
* 40 Series Miniature P.C.B. Relays 8 - 10 - 16 A.
* 41 Series Low-Profile P.C.B. Relays 8 - 12 - 16 A.
* 43 Series Low-Profile P.C.B. Relays 10 A.
* 44 Series Miniature P.C.B. Relays 6 -10 A.
* 45 Series Miniature PCB Relays 16 A.
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Customers around the world continue to rely on Bivar’s manufacturing and design strength when it comes to Optoelectronics (standard and custom) and Assembly Hardware.
We’re evolving to meet the increased demand for Solid State Lighting (SSL) with the introduction of our directional lighting series that addresses a growing range of industrial markets and applications. |
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* 55 Series Miniature General Purpose Relays 7 - 10 A.
* 56 Series Miniature PowerRelays 12 A.
* 60 Series General Purpose Relays 10 A.
* 62 Series Power Relays 16 A.
* 65 Series Power Relays 20 - 30 A.
* 66 Series Power Relays 30 A.
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Relay Contact : 1NO
Coil Voltage 10% (D.C) # : 6V , 12V , 24V , 48V
Max. Switching Voltage : 230 V ~ / 24 V -
Max. Continuous current : 10A
Terminal Block pitch ( mm ) : 5.08
No of channels : 1, 2, 4, 8, 16 |
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| Curtis Industries relay sockets are engineered to produce a perfect result in every application. At Curtis Industries our commitment to excellence and our patented design technology assure consumers of Curtis relay sockets superior performance and reliability. Curtis Industry relay sockets utilize the follow features and many more. |
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| The 700 series sockets have the perfect mix of historical Magnecraft socket quality combined with a dynamic arsenal of options. When mated with the Magnecraft relays and accessories, these RoHS compliant sockets provide a complete modular system that will meet all your plug-in relay requirements in a package that is both visually appealing and functionally outstanding resulting in a Complete Solution. |
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Snap-on mounting on DIN-rail, Easy replacement of relays on a densely packed DIN rail, Module width 6.2 mm
DC and AC version, Electrical indicator as standard (LED)
Retainer clip with ejection function for relays of 29 or 35mm
height, Screw mounting
Pozidrive screws with rising clamp terminals
Logical layout of input-/output connections, Plug-in indicator- and protection modules
Din-rail sockets and accessories: RoHS compliant (Directive 2002/95/EC)
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For relays with forcibly guided contacts which are particularly adapted to suit the relay characteristics, ELESTA relays can provide sockets for relay series and accessories for DIN rails using both screw and PCB mounting.
- SRD-SGR2 DIN rail socket for relay series SGR282Z and SIR282
- SRD-SGR2 DIN PCB socket for relay series SGR282Z and SIR282
- SRD-SIM4 Manipulation-protected DIN rail socket for relay series SIM3 and SIM4
- SRD-SIM4 Manipulation-protected PCB socket for relay series SIM3 and SIM4
- SRD-SIM4 Manipulation-protected PCB socket for relay series SIR4 and SIR4 SEN
- SRP-SIM4 Manipulation-protected PCB socket for relay series SIR6 and SIR4 SEN
- Approvals: UL, cUL,
Areas of application: lifts, machine tools, lifting technology, transportation |
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The Bergquist Company is the world leader in the development and manufacture of thermally conductive interface materials. Thermal Clad Insulated Metal Substrate (IMS®) was developed by Bergquist as a thermal management solution for today's higher watt-density surface mount applications where die size is reduced and heat issues are a major concern.
Thermal Clad Benefits Include:
Lower operating temperature
Reduce printed circuit board size
Increase power density
Extend the life of dies
Reduce the number of interconnects
Improve product thermal and mechanical performance
Combine power and control
Improve product durability
Enable better use of surface mount technology
Reduce heat sinks and other mounting hardware including thermal interface material
Replace fragile ceramic substrates with greater mechanical durability
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CORETEC is able to propose to you all types of cores magnetic, out of C, ovals, rectangular, three-phase, special.
We manufacture your magnetic core so that he meets your need and adapts to all types of applications. |
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| At Radius Power, we have partnered with our key supplier of power ferrites to further enhance our capability to offer total power solutions. Specializing in mid to large power ferrite cores, we are able to offer component and wound solutions for the most common geometries and applications. |
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| ... products without technical information |
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Materials and mountings for electronics
