Machines for electronics production

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belt conveyor / for printed circuits - Genius

The e³ GENIUS is a state of the art board handling solution which can be utilized in any PCB production line. The...

belt conveyor / for printed circuits - Smart

The e³ SMART lineup of plug and play board units are cost efficient and feature seamless magazine loading/unloading and speedy width adjustment....

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flexible assembly machine - max. 2000 mm | SmartCell

The Smart Cell Comau is a parallel assembly hub that is perfectly suited for low to moderate volume automated assembly of parts that need stringent tolerances. Its value propositions include dependability that is proved in manufacturing and parallel process vs....

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SMT pick-and-place machine - Σ-G5

The Sigma-G5, which is manufactured by Hitachi, is SMT equipment that has been developed...

SMT pick-and-place machine / ultrahigh-speed - Σ-F8

Introducing the Sigma-G5 which is another machine of SMT equipment. This unit suggest an excellent...

die bonder fully-automatic - DB-800HS

The DB-800HS Die Bonder manufactured by Hitachi, offers high-speed Sip Assembling to semiconductor applications. Its framework comprises...

full automatic assembly system for LCD - AL/AB7000 Series

The Hitachi High-Tech AL/AB7000Series Module Assembly System is designed for 57, 47,...

full automatic assembly system for LCD - AK/AL/AB6000 Series

Hitachi has developed the AK/AL/AB6000 series built as a complete automatic assembly...

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photolithography equipment - 15 mm², 11.23 x 18 mm, 2.0 µm | NES1h04

The small-size highly cost effective Projection Exposure System has...

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the electronics industry screen printing machine - SPG

Panasonic's SPG high-speed screen printing machine provides eco-friendly solutions for lean SMT manufacturing. It provides the ideal amount of solder in the correct...

the electronics industry screen printing machine - SP70

Panasonic's SP70 screen printer is engineered for both high and low volume manufacturers who has a high...

two-stage screen printing machine / for the electronics industry - SPD

The screen printer dual (SPD) offers fast and successive production of two boards of the same type or two differing products. Its non-stop changeover features deliver...

placer electronics - max. 25 000 cph/m² | NPM-D2

The Panasonic NPM-D2 Dual Lane Assembly delivers a seamless and efficient electronics assembly production process, all via a singular-platform. It features a switchable, plug-and-play...

placer electronics - 70 000 cph | NPM-W

The NPM-W (Next Production Modular - Wide) is a piece of Panasonic's award winning NPM stage for growing and advancing hardware get together needs.

Transforming huge block sizes to 750 x 550mm (29.5 x 21.6") and putting extensive...

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placer electronics - 70 000 cph | NPM-W

Miyachi Unitek provides a selection of in-line laser welding, marking, engraving, cutting, and bonding systems...

lid placing and sealing machine for electronics production - AF8500

The AF8500 series of Lid Placement, Tack and Seam Sealing Systems from MIYACHI are used for hermetic sealing applications, and may be modified to be a stand-alone or a fully...

electronics production precision sealer -  SM8500

A complete machine on it's own, TCT5510-6G's advanced technology provides high safety and reliability for the user. It is equipped with its own safety devices and compartment...

hot-bar reflow soldering machine / manual - Newhorizon

The Hot-Bar Reflow Soldering & Heat Staking Systems from MIYACHI offers the services of standard...

hot-bar reflow soldering machine / manual - DT series

The DT Series Desktop Hot-Bar Bonding Systems are ideal for heat staking and hot bar reflow...

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hot-bar reflow soldering machine / manual - DT series

Nordson EFD PICO valve dispensing systems incorporates high production speed with high...

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die bonder fully-automatic - Esec 2009 SSIE

The Esec Die Bonder is a newly engineered die attach. It has a new point to line, pick and place...

die bonder flip-chip - max. 350 °C | 2200 evo

The Datacon 2200 evo series of multi-module die attach machines from BESI, tends to applications...

die bonder - 2200 evoplus

Combining integrated dispenser and vision alignment with automatic tool and wafer changer...

die bonder epoxy - Esec 2100 xP

The Esec 2100 xP, assembled by Besi, is a well tested die bonding device that is capable of operating at full range of epoxy die mounting applications....

die bonder epoxy - Esec 2100 xPplus

The Die Bonder Esec 2100 xPplus is a 300 mm high velocity platform designed for functional capacity operation such as...

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insertion machine - CRD series

Simultaneous multiple-pin insertion will definitely increase productivity and this should be applied whenever possible. This machine, based on SPIROLs standard Model CR design is a very strong and stable dual vertical pin insertion...

insertion machine - CR series

The model CR is a robust, vertical pin-insertion machine that's ideally suited for moderate to high production for applications requiring up to 1,800lbs of installation force. Precision...

insertion machine - DP series

SPIROL Model DP is a self contained vertical drilling and pinning machine. It has been developed for mid-to-high volume production systems that demand precise assembly drilling and pinning. The use of a single system for both drilling and pinning removes the need for close tolerance...

insertion machine - HC series

This device is just easy to handle for it is not heavy and mobile. The unit is a horizontal pin inserter made to affix certain...

insertion machine manual - HM series

The HM Series, which is manufactured by Spirol, is an installation system that is typicallly designed...

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jet dispensing system - PICO®

The PICO dispensing system by Nordson EFD combines superior process control and accuracy with high production speeds, being suitable for various applications in the industry, available in three...

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reflow soldering oven - Ersa HOTFLOW 4/26

The HOTFLOW 4/26 is a reflow soldering system from Ersa. The machine has an optimal thermal performance and the ideal energy balance.

This...

reflow soldering oven - 6 m | HOTFLOW 3/20e

The HOTFLOW 3/20e is the freshest reflow structure in the Ersa HOTFLOW family, and it passes on striking welding happens by excellence of its pervasive warm...

forced convection reflow soldering oven - 4 m | HOTFLOW 3/14

Ersa reflow ovens have been setting the industry standard for high-end reflow machines since their introduction into the market nearly 30 years ago. The new HOTFLOW is the third generation machine based on the proven & proprietary Ersa...

selective soldering machine - VERSAFLOW 3/45

High Volume Selective Soldering with Dual Transport

The new VERSAFLOW 3/45 is the world's first in-line selective soldering machine with...

wave soldering machine / nitrogen - POWERFLOW N2

The Powerflow N2 full nitrogen tunnel wave solder machine is designed for lead-free applications. It decreases lead-free wave solder operating costs by as much as 90%. A 16" board width, a plug-and-play pre-heat...

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wave soldering machine / nitrogen - POWERFLOW N2

Both circular and rectangular focuses are possible with the use of this product, whose typical applications include...

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SMT pick-and-place machine / automatic - 64 983 - 102 000 cph | SIPLACE X series

The X-series of Placement Systems from SIPLACE is the standard for applications that require optimum speed and precision. It offers maximum productivity...

SMT pick-and-place machine / automatic - 24 000 - 102 000 cph | SIPLACE SX series

The SIPLACE SX series which is manufactured by ASM is a placement solution for high-mix SMT that has been developed to provide...

SMT pick-and-place machine / automatic - 13 000 - 57 000 cph | SIPLACE Di series

The SIPLACE Di-Series is a placement system manufactured by ASM that employs original mechanisms such as the digital SIPLACE vision systems, the flexible SIPLACE dual-conveyor system and the...

SMT pick-and-place machine / automatic - 9 000 - 20 000 cph | SIPLACE CA series

As the world's first placement platform that incorporates bare-die from the wafer and classic SMT placement in a single machine and production process, the SIPLACE CA provides many benefits. This adds up to less special...

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laser selective soldering machine - 30 - 45W

The Laser Selective Soldering Machine, manufactured by Japan Unix, is specifically designed...

selective soldering machine - UNIX-700V

The Model UNIX-700V, manufactured by Japan Unix, is a highly versatile selective soldering machine....

selective soldering machine - UNIX-700H

The UNIX-700H is suitable for use in massive production, through its rapid circular...

selective soldering machine - UNIX-700S

The UNIX-700S Series manufactured by Japan Unix is a selective soldering machine, also called as...

laser selective soldering machine - UNIVERSE

Our UNIVERSE Series automatically selects, eliminates, inserts, and solders...

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laser selective soldering machine - UNIVERSE

The flying probe type testers in this product series include various features, including a 1116 high-speed pattern tester using the capacitance testing method. When compared to...

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laser selective soldering machine - UNIVERSE

These FE 71 applicator guns may be used with a pistol grip gun attachment,...

laser selective soldering machine - UNIVERSE

The Dispensing robotic cell Series, manufactured by Fusion Incorporated®, is a laboratory...

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wafer cutting machine - ±4μm | QAC&BACL, LDC

The machine LDC-5142 adopts 1064nm in-fared laser as cutting tool which gives a greater cutting quality. The advantages of the machine LDC-5142 are fast speed, easier processes, low maintenance cost. It is very suitable...

UV laser cutting machine / wafer - 355 Nm | UV/QAC&BACL

The UV laser wafer-dicing machine UV/QAC&BACL Series is manufactured by Wuhan HuaGong Laser Engineering Co.,Ltd. The product can adopt high-quality UV as cutting source, the cutting quality and...

UV laser cutting machine / wafer - 355 nm | LED UV/QAC&BACL

The LED UV/QAC&BACL, manufactured by Wuhan HuaGong Laser Engineering Co.,Ltd, is a UV laser wafer-dicing machine that adopts a UV laser source as well as a...

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solar wafer measurement module - PV-1000

The PV-1000 series is utilized in Push/Pull capacitance test engineering. Every PV-1000 module gives up to three sets of tests for estimation of greatest, least and normal thickness, and aggregate thickness variety...

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solar wafer measurement module - PV-1000

Aluminum sputtering targets from Plansee have a purity of 5N. This high purity prevent the...

solar wafer measurement module - PV-1000

The aluminum-chromium (AlCr) targets and cathodes further optimizes the toughness and resistance to oxidation of the nitride coatings of drills,...

solar wafer measurement module - PV-1000

Plansee manufactured a broad spectrum of products, which includes thin-film materials. One of the thin-film materials...

solar wafer measurement module - PV-1000

CIGS manufacturers generally use copper-indium-gallium (CuInGa) or copper-gallium (CuGa) sputtering...

solar wafer measurement module - PV-1000

The Copper Sputtering Target is designed and manufactured by Plansee. The tool features a high...

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chamber furnace / for low pressure carburizing / vacuum - ICBP® DUO series

The ICBP range has 2 chamber furnaces. There is one quenching cell and one heat chamber that uses the Infracarb patent for...

chamber furnace / for low pressure carburizing / vacuum / compact - ICBP Flex

The ICBP-FLEX multi-chamber furnaces have a modular concept that makes them the most innovative solution of the low pressure carburizing furnaces by ECM. The compact design of the Flex furnaces meets...

chamber furnace / for low pressure carburizing / vacuum - ICBP® JUMBO

Multi chamber furnaces have a modular concept with a central shuttle ICBP® JUMBO. It is the latest ECM solution design for the low pressure carburising furnace range. It retains all the compact and modular qualities of the ICBP®. The...

horizontal furnace / quenching / carburizing / brazing - max. +750 °C | FULGURA

The Fulgura series is a range Multiflow quenching furnace from ECM. The series is generally used for steel tool...

horizontal furnace / annealing / tempering / nitriding - max +750 °C | VESUVE

The VESUVE series is composed of vacuum annealing tempering furnaces developed by ECM Technologies. It is equipped with a reeved organized...

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