Machines for electronics production

192 companies | 1051 industrial products

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2 products FlexLink
FlexLink Genius
printed circuit board belt conveyor Genius FlexLink

As the result of a careful standardisation process, e³ GENIUS is extremely flexible and can be used...

FlexLink Smart
printed circuit board belt conveyor Smart FlexLink

The e³ SMART line features cost efficient, plug and play board handling units with quick width adjustment and easy...

Hitachi High-Technologies Europe Σ-G5
SMT pick & place machine Σ-G5 Hitachi High-Technologies Europe

Sigma-G5 offers exceptional flexibility in a modular mounter....

Hitachi High-Technologies Europe Σ-F8
ultra highspeed SMT pick & place machine Σ-F8 Hitachi High-Technologies Europe

Σ-F8 Modular Ultra Highspeed Placementsystem High Productivity 4 beams & 4 heads / module Employ...

Hitachi High-Technologies Europe DB-800HS
fully-automatic die bonder DB-800HS Hitachi High-Technologies Europe

300mm Die Bonder - Engineered for High Speed Sip Assembling Laser length measurement combined with mechanical dispenser results in high precision paste application...

Hitachi High-Technologies Europe AL/AB7000 Series
full automatic assembly system for LCD AL/AB7000 Series Hitachi High-Technologies Europe

A full automatic module assembly system for 57, 47, 37and27inch line-up size. Realized...

Hitachi High-Technologies Europe AK/AL/AB6000 Series
full automatic assembly system for LCD AK/AL/AB6000 Series Hitachi High-Technologies Europe

Full automatic assembly system for COG, TAB and PCB bonding A full automatic module assembly system for...

Hitachi High-Technologies Europe AX1000
multi-function assembly system for small size LCD AX1000 Hitachi High-Technologies Europe

COG, TAB, COF, and FPC can be mounted by replacement of object parts feeding unit A COG, TAB, COF, or FPC mounting system for small...

Panasonic Factory Automation Company max. 25 000 cph/m² | NPM-D2
electronic component mounting machine max. 25 000 cph/m² | NPM-D2 Panasonic Factory Automation Company

The NPM-D2 (Next Production Modular) provides a completely integrated single-platform solution for expanding and evolving electronics assembly needs. In addition to its interchangeable, plug-and-play...

Panasonic Factory Automation Company 70 000 cph | NPM-W
electronic component mounting machine 70 000 cph | NPM-W Panasonic Factory Automation Company

The NPM-W (Next Production Modular - Wide) is part of Panasonic’s award-winning NPM platform for expanding and evolving electronics assembly needs. Processing large board sizes up to 750 x 550mm (29.5...

Panasonic Factory Automation Company 36 000 cph | NPM-TT
electronic component mounting machine 36 000 cph | NPM-TT Panasonic Factory Automation Company

The NPM-TT (Next Production Modular-Twin Tray) is the latest model from Panasonic’s award-winning NPM platform for expanding and evolving electronics assembly requirements. Further bolstering the SMT...

Panasonic Factory Automation Company AM100
SMT pick & place machine AM100 Panasonic Factory Automation Company

The AM100 maintains the high standards for capability, flexibility, and reliability customers expect from Panasonic in a cost-effective, incrementally scalable, high-mix SMT solution. Only one machine...

Panasonic Factory Automation Company 30 000 cph | BM12x series
SMT pick & place machine 30 000 cph | BM12x series Panasonic Factory Automation Company

When you’re looking for highly productive, low cost per placement and exceptional quality - Panasonic’s BM123 and BM133 modular placement machines are the answer. Panasonic’s...

Panasonic Factory Automation Company max. 12 000 cph | BM221
SMT pick & place machine max. 12 000 cph | BM221 Panasonic Factory Automation Company

For a general-purpose machine that offers a versatile range of component handling along with high performance, the Panasonic BM221 microchip and...

COMAU S.p.A. - Powertrain Systems max. 2000 mm | SmartCell
flexible assembly machine max. 2000 mm | SmartCell COMAU S.p.A. - Powertrain Systems

The Smart Cell Comau is a parallel assembly station ideal for low-medium volume automated assembly of components requiring tight tolerances. Value Propositions Reliability proved...

7 products Miyachi
Miyachi
laser workstation for material processing Miyachi

Addressing the demand for in-line manufacturing cells, Miyachi Unitek’s range of in-line laser...

Miyachi AF8500
lid placing and sealing machine for electronics production AF8500 Miyachi

The Autoflow system is flexible enough to meet the ever-increasing demands of lid placement and seam sealing applications. It can be configured either as a stand-alone unit or as part of a fully integrated...

Miyachi  SM8500
precision sealing machine for electronics production SM8500 Miyachi

Packed with advanced features, the Windows®-based SM8500, reliably performs hermetic resistance welding, brazing, and soldering processes on a variety of metals,...

Miyachi Newhorizon
manual hot-bar reflow soldering machine Newhorizon Miyachi

Hot-Bar Reflow Soldering & Heat Staking Systems - newhorizon Compact, Standard...

Miyachi DT series
manual hot-bar reflow soldering machine DT series Miyachi

Miyachi Unitek’s Desktop Bonders are table top hot-bar systems which utilize pulsed heat thermode...

Miyachi Emerald series
LCD repair station Emerald series Miyachi

Hot Bar Bonding LCD Repair Station - Emerald Series...

1 products Nordson Efd
Nordson Efd
jet dispensing system Nordson Efd

Nordson EFD PICO valve dispensing systems combine high...

new BE Semiconductor Industries Esec 2009 SSIE
fully-automatic die bonder Esec 2009 SSIE BE Semiconductor Industries

The new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its...

new BE Semiconductor Industries Fico Compact Line - X
wafer dicing machine Fico Compact Line - X BE Semiconductor Industries

The new Fico Compact Line - X (FCL-X) is the latest development in Trimming & Forming and processes extreme high density leadframes...

BE Semiconductor Industries max. 350 °C | 2200 evo
flip-chip die bonder max. 350 °C | 2200 evo BE Semiconductor Industries

The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility...

BE Semiconductor Industries 2200 evoplus
multi-chip die bonder for flip chip and die attach 2200 evoplus BE Semiconductor Industries

The Datacon 2200 evoplus die bonder for Multi Module Attach assembles all kinds of technologies on a tried-and-tested platform,...

BE Semiconductor Industries Esec 2100 xP
epoxy die bonder Esec 2100 xP BE Semiconductor Industries

The proven epoxy Die Bonder Esec 2100 xP is the most flexible 300 mm high speed platform, capable of running the full range...

BE Semiconductor Industries Esec 2100 xPplus
epoxy die bonder Esec 2100 xPplus BE Semiconductor Industries

The Die Bonder Esec 2100 xPplus is the the 2nd generation of the most flexible 300 mm high speed platform, capable of running...

11 products SPIROL
SPIROL CRD series
pin insertion machine CRD series SPIROL

Whenever simultaneous multiple-pin insertion is feasible and practical, it should be considered to enhance productivity. This robust, dual vertical pin insertion machine is based on SPIROLs standard Model CR...

SPIROL CR series
pin insertion machine CR series SPIROL

The Model CR, a semi-automatic machine designed for moderate to high force installations, can be enhanced to incorporate the use of a load cell system, capable of determining the actual force required...

video SPIROL HC series
pin insertion machine HC series SPIROL

This lightweight, portable, horizontal Pin Inserter is designed to install SPIROL Series 550 Coiled Pins into plastic hinges. The cylinder/driving...

video SPIROL HM series
manual pin insertion machine HM series SPIROL

As much as 75% of an Inserts performance is the direct result of how well it was installed. Therefore, in order...

video SPIROL HP series
pneumatic pin insertion machine HP series SPIROL

The SPIROL Model HP Pneumatic Heat Insert Driver provides an accurate and consistent method to install virtually any type of Heat/Ultrasonic Style Insert into thermoplastic assemblies. As much as 75%...

video SPIROL PH series
pin insertion machine PH series SPIROL

The SPIROL Model PH Heat Insert Driver provides an accurate and consistent method to simultaneously install multiple Inserts or Compression Limiters at multiple elevations. Simultaneous installation dramatically increases...

1 products EFD
video EFD PICO®
jet dispensing system PICO® EFD

Nordson EFDʼs PICO dispensing systems combine high production speed with exceptional accuracy and process control. Three configurations are available to handle virtually any application. Non-contact...

1 products Laserline GmbH
Laserline GmbH
laser brazing head Laserline GmbH

Rectangular and circular focus possible Typical applications: brazing of metals and in BIW Integrated...

video ASM Assembly Systems 64 983 - 102 000 cph | SIPLACE X series
automatic SMT pick & place machine 64 983 - 102 000 cph | SIPLACE X series ASM Assembly Systems

Among electronics manufacturers, the SIPLACE X-Series is considered the benchmark wherever maximum speed and absolute precision are required (mobile phones, tablets, notebooks, LED placement,...

ASM Assembly Systems 24 000 - 102 000 cph | SIPLACE SX series
automatic SMT pick & place machine 24 000 - 102 000 cph | SIPLACE SX series ASM Assembly Systems

The SIPLACE SX puts scalability and flexibility at the top of the list. With the SIPLACE SX, users can introduce new products more quickly, change...

ASM Assembly Systems 13 000 - 57 000 cph | SIPLACE Di series
automatic SMT pick & place machine 13 000 - 57 000 cph | SIPLACE Di series ASM Assembly Systems

The digital SIPLACE Di-Series has aquired its reputation as the price-performance leader because of its perfect combination of high-tech innovations and proven technologies. In terms of performance and...

video ASM Assembly Systems 9 000 - 20 000 cph | SIPLACE CA series
automatic SMT pick & place machine 9 000 - 20 000 cph | SIPLACE CA series ASM Assembly Systems

The SIPLACE CA is the world’s first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production process. The benefit:...

52 products ASYS
new ASYS X4 SI
screen printing machine for electronic industry X4 SI ASYS

Thanks to the latest drives, the X4 SI screen and stencil...

ASYS VEGO Compact BDS 01
PCB destacker VEGO Compact BDS 01 ASYS

The magazine stack height is 200 mm, new PCBs can...

ASYS VEGO Compact BLO 01
PCB destacker VEGO Compact BLO 01 ASYS

The unit uses an electrical extractor to load PCBs from...

ASYS VEGO Compact BLO 03
PCB handling system VEGO Compact BLO 03 ASYS

The Line Loader loads PCBs from magazines into the line. The magazine platform can accommodate up to...

ASYS VEGO Compact BLO 04
PCB handling system VEGO Compact BLO 04 ASYS

It can easily be adapted to any magazine size. 3 to 5 magazines can be loaded...

ASYS VEGO Compact BST 01
PCB handling system VEGO Compact BST 01 ASYS

A lift unit then ads the PCB to the bottom of the stack....

25 products Ersa GmbH
Ersa GmbH 5 m | HOTFLOW 3/20
reflow soldering oven with long heating tunnel 5 m | HOTFLOW 3/20 Ersa GmbH

Since their introduction into the market nearly 30 years ago, Ersa reflow ovens have been setting the industry standard for high-end reflow machines. The new HOTFLOW is the third generation machine based...

Ersa GmbH 6 m | HOTFLOW 3/20e
reflow soldering oven with long heating tunnel 6 m | HOTFLOW 3/20e Ersa GmbH

The HOTFLOW 3/20e is the newest reflow system in the Ersa HOTFLOW family, and it delivers exceptional soldering results on account of its superior thermal performance, its low transverse profile and its...

Ersa GmbH 4 m | HOTFLOW 3/14
dual lane forced convection reflow soldering oven 4 m | HOTFLOW 3/14 Ersa GmbH

Since their introduction into the market nearly 30 years ago, Ersa reflow ovens have been setting the industry standard for high-end reflow machines. The new HOTFLOW is the third generation machine based...

Ersa GmbH 4 m | HOTFLOW 3/14e
reflow soldering oven 4 m | HOTFLOW 3/14e Ersa GmbH

The HOTFLOW 3/14e is the newest reflow system in the Ersa HOTFLOW family, and it delivers exceptional soldering results on account of its superior thermal performance, its low transverse profile and its...

Ersa GmbH 2.5 m | HOTFLOW 2/12
reflow soldering oven 2.5 m | HOTFLOW 2/12 Ersa GmbH

The completely re-engineered HOTFLOW 2/12 reflow oven has been designed to deliver the excellent results...

video Ersa GmbH POWERFLOW N2
nitrogen wave soldering machine POWERFLOW N2 Ersa GmbH

The Ersa POWERFLOW N2 - a full nitrogen tunnel wave solder machine - was specifically designed to meet the challenges of lead-free soldering! Being Ersa’s flagship machine, the POWERFLOW N2 can reduce...

HIOKI E.E. CORPORATION
flying probe impedance test system for printed circuit boards HIOKI E.E. CORPORATION

Flying probe type testers: Product features (Models 1116, 1117, 1270, etc.) The 1116 is a high-speed pattern tester that uses the capacitance testing method. Compared...

C.I.F. Circuit Imprimé Français 200 x 300 mm | BB4
PCB bubble etching machine 200 x 300 mm | BB4 C.I.F. Circuit Imprimé Français

Thermostated heater with digital thermometer. • complete welded PVC. • Strong, perfect for first and second grade education and laboratories. •...

C.I.F. Circuit Imprimé Français AUTOJET II
double-sided PCB vertical spray etching machine AUTOJET II C.I.F. Circuit Imprimé Français

Double sided model with rinsing and thermostated heater (water inlet, draining...

C.I.F. Circuit Imprimé Français 200 mm | METEOR 220
double-sided PCB horizontal spray etching machine with conveyor 200 mm | METEOR 220 C.I.F. Circuit Imprimé Français

Double sided etching with rinsing stage • Transport by conveyor • Working...

C.I.F. Circuit Imprimé Français 300 mm | PHENIX 300
double-sided PCB horizontal spray etching machine with conveyor 300 mm | PHENIX 300 C.I.F. Circuit Imprimé Français

Temps de gravure en 45 secondes avec agent de gravure neuf ! • Largeur de gravure utile 300 mm • Gravure double face avec rinçage • 24 buses de pulvérisation à jets plats. •...

C.I.F. Circuit Imprimé Français Technodrill 2
printed circuit board cutting and drilling machine Technodrill 2 C.I.F. Circuit Imprimé Français

ETCH, DRILL, MILL, CUT AND ALL KIND OF WORK WITH THE TECHNODRILL 2. A "Polyvalent Machine" for your electronic laboratory . interpolation...

video Fusion Incorporated
brazing paste dispensing gun Fusion Incorporated

Fusions new pistol grip gun attachment is compatible with FE-71 applicator...

video Fusion Incorporated
brazing paste dispensing robotic cell Fusion Incorporated

Satellite Paste Applicators are designed to complement an existing heat source, such...

MTI Instruments PV-1000
solar wafer measurement module PV-1000 MTI Instruments

Using MTII’s exclusive Push/Pull capacitance probe technology, each PV-1000 module provides up to three pairs of probes for measurement of maximum, minimum and average thickness, as well as total thickness...

17 products PLANSEE
PLANSEE
aluminum sputtering target PLANSEE

Aluminum possesses very high electrical conductivity....

PLANSEE
aluminum-chromium sputtering target PLANSEE

Our aluminum-chromium (AlCr) targets and cathodes further...

PLANSEE
chromium sputtering target PLANSEE

The hard material coatings chromium (Cr) and chromium nitride (CrN) optimally protect engine components such as piston rings and bucket tappets...

PLANSEE
copper-gallium sputtering target PLANSEE

Many CIGS manufacturers use copper-gallium (CuGa) or copper-indium-gallium (CuInGa) sputtering targets for the deposition of the absorber layer....

PLANSEE
copper sputtering target PLANSEE

Due to its high electrical conductivity, copper is becoming increasingly popular for...

PLANSEE
molybdenum sputtering target PLANSEE

Molybdenum coatings are the crucial components of the thin-film transistors used...

new Kulicke & Soffa Ind. IConnPS ProCu PLUS™
wire bonder IConnPS ProCu PLUS™ Kulicke & Soffa Ind.

IConnPS ProCu PLUSTM is the new State-of-the-Art in Copper Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver...

new Kulicke & Soffa Ind. IConnPS ProCu PLUS™ LA
wire bonder IConnPS ProCu PLUS™ LA Kulicke & Soffa Ind.

IConnPS ProCu PLUSTM LA is the new State-of-the-Art in Copper Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will...

new Kulicke & Soffa Ind. ConnX PlusPS
high-speed wire bonder ConnX PlusPS Kulicke & Soffa Ind.

ConnX PlusPS High Speed Wire Bonder is a second generation ball bonder introduced under the highly successful Power Series, which further increases net productivity setting new standard and bench marks...

new Kulicke & Soffa Ind. PowerFusionPS™
semiconductor wedge bonder PowerFusionPS™ Kulicke & Soffa Ind.

Orthodyne PowerFusionPSTM Wedge Bonders are driven by a new powerful direct-drive motion system and expanded pattern recognition capabilities which deliver industry leading productivity and reliability....

Kulicke & Soffa Ind. IConn ProCuPS
wire bonder IConn ProCuPS Kulicke & Soffa Ind.

High Performance Copper Wire Bonder The State-of the-Art Performance of IConnPS - the World’s leading Wire Bonder - was the starting point...

Kulicke & Soffa Ind. IConn ProCu LAPS
wire bonder IConn ProCu LAPS Kulicke & Soffa Ind.

The IConn ProCu LAPS High Performance Large Area Wire Bonder is another extension of the successful Power Series platform. With the extended bondable area, the IConn ProCu LAPS helps you to achieve...

12 products Japan unix
Japan unix 1.6 kW | USS‐350E
soldering bath 1.6 kW | USS‐350E Japan unix

Models USS-350E (ET) Bath size Approx. 33kg Max temp. 300°C/572...

Japan unix 950 W | USS‐250E
soldering bath 950 W | USS‐250E Japan unix

Models USS-250E (ET) Bath size Approx. 15kg Max temp. 300°C/572...

Japan unix 750 W | USS‐180E
soldering bath 750 W | USS‐180E Japan unix

Models USS-180E (ET) Bath size Approx. 9kg Max temp. 300°C/572...

Japan unix 2.1 kW | USS‐170HE
soldering bath 2.1 kW | USS‐170HE Japan unix

Models USS-170HE (HET) Bath size Approx. 10kg Max temp. 450°C...

Japan unix 5 kW | USS‐350HE
soldering bath 5 kW | USS‐350HE Japan unix

Models USS-350HE (HET) Bath size Approx. 25kg Max temp. 450°C...

Japan unix 550 W | USS‐60HE
soldering bath 550 W | USS‐60HE Japan unix

Models USS-60HE Bath size Approx. 1.4kg Standard temp. 400°C/752F Standard...

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