Used for automatic and laser marking of scrap units on carrier products, which facilitates efficient and accurate identification of subsequent processes, and improves the product yield and process efficiency of customer factories.
Equipment characteristics
• Double-station operation to realize high-speed processing of bad board marks on IC substrate
• Configure energy monitoring system to ensure the stability of product processing effect
• It can automatically identify the front end process mark, or connect to the customer system to directly obtain the location information of the scrap board for marking
• The piracy mechanism realizes double-sided processing of the product, no adjustment is required when changing materials, which improves production efficiency and ease of use