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High Performance Microstepping Controller ASIC
The IM2000S is a high performance microstepping controller that incorporates a sine/cosine signal generator, anti-resonance circuitry, PWM current control and much more in one monolithic IC. The IM2000S combines hardware intense functions together with innovative features to provide designers with a powerful yet simple solution for their high volume OEM products.
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Melexis introduces a new versatile, fully integrated and programmable sensor interface solution for automotive and industrial applications. The MLX90320 provides amplification, calibration and temperature compensation for virtually all kinds of resistive bridge type sensors including pressure transducers, strain gauges and position sensors.
Melexis' Programmable Through Connector' concept for high-volume implementations, enables programming in the production environment post assembly.
An operating temperature range of -40°C to 150°C as well as various implemented clamping detection and fault/diagnosis modes, over-voltage and reverse polarity protection make the MLX90320 the perfect fit for automotive applications.
An Evaluation Board for this new MLX90320 chip is available.
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The industry standard ARM architecture is the most widely used 32-bit microprocessor architecture ever with billions of products shipped. Actel has partnered with ARM to make ARM processors available for our customers to use in Actel's Flash-based FPGAs. The processors are fully implemented in the FPGA fabric, and designers have full access to the cores, so they can add IP and implement them in their embedded applications. By offering the processors without license fees or royalties and without the need to negotiate contracts, Actel is dramatically increasing our customer's access to 32-bit ARM processors. FPGA users no longer have to settle for a proprietary 32-bit processor core. Instead, they can use an industry standard ARM processor with the well-known architecture and popular instruction set. With its FPGA optimized ARM processor offering, Actel is truly bringing ARM to the masses.
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Broadcom offers custom silicon design capability for applications where customers want to integrate their own intellectual property with Broadcom's proprietary intellectual property cores. We have successfully developed custom chips for LAN, WAN and PC applications. These chips are complex mixed-signal designs that leverage Broadcom's advanced design processes.
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Freescale Semiconductor offers Application Specific Integrated Circuits (ASIC) as well as highly integrated, customized System-on-Chip System (SoC) solutions for the printing and imaging, broadband, network, and storage markets. The Application Specific Products operation develops ASIC and SoC products built on a foundation of standard Freescale processor cores and proven peripheral intellectual property (IP). The offering is designed to provide customers with the benefits of scalable performance, fast time to market, low system cost, and flexible, System-on-Chip platforms that allow easy migration to next-generation system designs.
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Custom ASICs allow the ultimate combination of interfaces, processing capability, power and cost effectiveness enabling differentiated products that add real value to your end customer.
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Featuring Our SiGe (Silicon Germanium) Processes
Customer-Designed RF ASICs
Foundry Services
Five SiGe Processes!
4th Generation SiGe Technology Available
SiGe QuickChip%u2122 For Low NRE
Maxim is uniquely qualified to solve your high-frequency ASIC needs with our Complementary Bipolar, Bipolar, BiCMOS, SiGe (Silicon Germanium), or SiGe BiCMOS process technologies. Our RF ASIC offering includes Customer Owned Tooling (COT) and Foundry Services. Maxim offers:
Experience with more than 1000 mixed-signal and RF ASICs
Thirty years of ASIC experience
Leading-edge process technologies. Choose from five SiGe (Silicon Germanium) processes.
Accurate device models that have allowed a >90% first-pass success rate
Full custom or semi-custom (QuickChip) design methods
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AMI Semiconductor is a leading supplier of structured asic and cell-based digital solutions supporting a wide range of applications in the military/aerospace, high voltage communication, automotive, medical, and industrial markets.
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Epson has long experience in offering a variety of ASIC solutions to customers with its products of gate arrays, embedded arrays and standard cells. Epson continues to be your reliable ASIC development partner, meeting your demand for low profile compact products with quick turn around and developing design environments that always satisfy you.
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As a leading global ASIC provider and total-solutions provider, Fujitsu delivers innovative solutions that enable customers to differentiate their products and maximise their time-to-market advantage.
Together with skilled engineers, this builds up the environment required to develop and produce advanced ASIC designs
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ST offers our partners direct access to advanced technologies through a comprehensive set of libraries and CAD environments to achieve competitive time-to-volume performance.
ASIC/semicustom products play a key role in the IC industry in that they give to customers the ability to access leading edge silicon and packaging technologies and to use advanced IPs to give added value to their equipments.
In our concept customers remain the owners of their IC architecture, having the capability to define and drive their products autonomously, gaining the full control of product differentiation versus competition.
ST's semicustom organization structure focusses on getting your product into volume production in the shortest possible time.
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Samsung delivers a total solution, including deep sub-micron design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging and testing capabilities. The result is a shortened design cycle, lower risk and a much higher likelihood of first-time silicon success.
ASIC solutions at a glance:
Advanced process technology and complete design services
Leader in mixed-signal designs, with silicon-proven IP
Broad expertise to enable product differentiation:
- SoC
- Embedded DRAM & Flash
- SerDes
- ARM processors
Support of key applications such as:
- Mobile devices (smartphones, PDAs, GPS)
- Storage (disc drives, enterprise storage)
- Printers (ink jet, laser jet)
Advanced packaging & testing services featuring:
- System-in-Package (SiP)
- Fine-pitch BGA
- Flip Chip
Regional design centers help speed development
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Toshiba offers a large family of application specific integrated circuit (ASIC) covers from ASIC 0.009µm (TC-300 family) to ASIC 0.3 µm (TC-220 family).
The TC300 family of ASICs are designed for the highest-performance, next-generation products ranging from networking and server applications to digital multimedia devices that manage audio/video information and portable devices that require the lowest power consumption. The TC300 family delivers approximately a 100% increase in gate integration, 20% increase is gate speed and a 50% reduction in power consumption compared to previous generation 130nm process technology. It's built on Toshiba's proven CMOS process technology (CMOS4) that permits easy mixing of mixed signal, DRAM and applications specific IP cores on the same chip. It supports two types of DRAM cores optimized for speed or density, Toshiba qualified primitives, I/Os and SRAMs, as well as a high-speed SerDes for a range of applications.
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Features
* 4-20 GHz High Isolation SPDT
* <0.9 dB Typical Insertion Loss
* 35 dB Nominal Isolation
* 12 dB Typical Return Loss
* On-Chip Bias Network
* DC blocked at RF ports
* Chip dimensions: 2.24 x 1.63 x 0.10 mm (0.087 x 0.063 x 0.004 in)
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Ever-increasing system complexity, never-ending cost pressures, continually shrinking available space for electronics, and ever-higher quality requirements top the list of trends that relentlessly drive ASIC development.
To help its customers meet these rigorous demands, AMI Semiconductor relies on its three decades of experience in creating and integrating functional circuit blocks that meet specific customer needs.
AMIS couples this expertise with a strong focus on dedicated high-voltage, mixed-signal technologies, know-how in complex system level integration, and a corporate-wide design methodology that is specially tuned to the unique requirements of mixed-signal design.
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In the recent years, EM has expanded its large experience in low-power mixed-signal IC development to the imaging and photonics branches. Depending on the requirements of the various applications, different low-power embedded CMOS image sensor solutions with analog and/or digital outputs are possible. EM has focused on the development and production of customized Photo-ASICs rather than standard image sensing products.
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austriamicrosystems is a leading supplier of analog and mixed signal ASICs (Application Specific Integrated Circuits), designed for global leaders in the Automotive, Communications, Industry and Healthcare markets.
Our goal is to ensure a strategic partnership for a secure long-term source of supply.
Available ASIC Building Blocks
Power Management
Mobile Entertainment
Wireline Communication
Bus Systems
Car Access
Metering
Sensors / Sensor Interfaces
Medical
High Voltage
General Digital IPs
General Analog IPs
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EEA001 Enhanced micro-stepping controller of 2 phase stepping motors drives.
The ASIC EEA001 is a complete controller of enhanced, high performance, drives for stepping motors integrating the functions of sequencer and power stages control and protection against overcurrent,over & under-voltage, over-temperature. Mastered by the standard step motor drive's controls (Step, Direction, Enable) it ensures the highest motor's performances through the execution of Micro-stepping movements at high step resolution (up to 1/256) permitted by no odd harmonics sinusoidally shaped winding currents (Maximum step frequency: 2,56 MHz). The ASIC also allows to set a smoothing factor to optimize the drive and motor performances in terms of:
- high speed and torque at shaft - low heating of the drive
- no vibrations - low heating of the motor
- no resonances - very low mechanical noise
Designed to manage two power-stages configured as "H-bridge" working in bipolar chopper mode, the ASIC features a switching frequency of 33 kHz and a circuitry interfacing the drive's power stages designed to offer the widest compatibility with the most popular integrated circuits for MOSFET and IGBT gates driving, being compatible with most of cheap monolithic power circuits too.
ASIC's set up inputs can fit for drive's end user application step angle and phase current, activating the optional automatic current reduction at standstill, of the motor, and several optional drive operating modes such as CLK_UP/CLK_DWN, inputs active edge and Enable input polarity.
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