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| Atmel SiliconCity™ ASICs are the ideal choice for medium- to high-volume projects where optimum performance, die size, power consumption and unit cost are essential. Atmel ASICs keep design time, cost and risk to a minimum by extensive IP re-use, and by using a design flow that has been optimized on the basis of more than twenty years of successful projects. Atmel offers a range of ASIC process technology options including leading-edge digital CMOS for maximum performance, and mature mixed analog-digital and embedded MVM variants that keep NRE costs to a minimum. |
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Broadcom offers custom silicon design capability for applications where customers want to integrate their own intellectual property with Broadcom's proprietary intellectual property cores. We have successfully developed custom chips for LAN, WAN and PC applications. These chips are complex mixed-signal designs that leverage Broadcom's advanced design processes.
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Our product range includes Gate Arrays that address the need for fast turnaround at low IC development costs, Standard Cells that make System Solutions possible at the lowest unit price, and Embedded Arrays that combine the fast turnaround time for Gate Arrays with the ability to implement system level funcionality on-chip available with Standard Cell.
The Gate Array is a member of the ASIC family that offers Quick Turn Around Time during the development cycle at the lowest development cost. This is achieved by Epson stocking pre-fabricating Base/Bulk wafers that have transistors arranged in the form of an array. Our customers design the "wiring", that connects the transistors, that bring specific functionality to the design of the ASIC.
Bulk wafers are prefabricated with a different numbers of transistors giving customers a wide range of choices to implement their circuits, thereby giving customers a choice of adding or subtracting functionality from the design offering flexibility.
The Embedded Array combines the fast turn around time of gate arrays with the ability to implement system level functionality available in Standard Cell. The fast turn around is accomplished by starting some of the wafer fabrication processes in parallel with the Embedded array design process. In selecting an Embedded Array approach, the designer trades off the ability to change the Bulk in the last minute, possible with a gate array, with the need to implement system level functionality, with gate array like turn around.
By offering Gate Array, Standard Cells, and Embedded Arrays;Epson offers a choice to meet the individual needs of our customers. |
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| Freescale Semiconductor offers Application Specific Integrated Circuits (ASIC) as well as highly integrated, customized System-on-Chip System (SoC) solutions for the printing and imaging, broadband, network, and storage markets. The Application Specific Products operation develops ASIC and SoC products built on a foundation of standard Freescale processor cores and proven peripheral intellectual property (IP). The offering is designed to provide customers with the benefits of scalable performance, fast time to market, low system cost, and flexible, System-on-Chip platforms that allow easy migration to next-generation system designs. |
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| Our ASIC designers look back on many years of experience in the field of design, development and support services for application-specific circuits with analog, digital and mixed technology in ASICs or FPGAs. |
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| Custom ASICs allow the ultimate combination of interfaces, processing capability, power and cost effectiveness enabling differentiated products that add real value to your end customer. |
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Featuring Our SiGe (Silicon Germanium) Processes
Customer-Designed RF ASICs
Foundry Services
Five SiGe Processes!
4th Generation SiGe Technology Available
SiGe QuickChip%u2122 For Low NRE
Maxim is uniquely qualified to solve your high-frequency ASIC needs with our Complementary Bipolar, Bipolar, BiCMOS, SiGe (Silicon Germanium), or SiGe BiCMOS process technologies. Our RF ASIC offering includes Customer Owned Tooling (COT) and Foundry Services. Maxim offers:
Experience with more than 1000 mixed-signal and RF ASICs
Thirty years of ASIC experience
Leading-edge process technologies. Choose from five SiGe (Silicon Germanium) processes.
Accurate device models that have allowed a >90% first-pass success rate
Full custom or semi-custom (QuickChip) design methods |
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ST offers our partners direct access to advanced technologies through a comprehensive set of libraries and CAD environments to achieve competitive time-to-volume performance.
ASIC/semicustom products play a key role in the IC industry in that they give to customers the ability to access leading edge silicon and packaging technologies and to use advanced IPs to give added value to their equipments.
In our concept customers remain the owners of their IC architecture, having the capability to define and drive their products autonomously, gaining the full control of product differentiation versus competition.
ST's semicustom organization structure focusses on getting your product into volume production in the shortest possible time.
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Samsung delivers a total solution, including deep sub-micron design expertise, an unequalled IP portfolio, high-volume silicon manufacturing, and advanced packaging and testing capabilities. The result is a shortened design cycle, lower risk and a much higher likelihood of first-time silicon success.
ASIC solutions at a glance:
Advanced process technology and complete design services
Leader in mixed-signal designs, with silicon-proven IP
Broad expertise to enable product differentiation:
- SoC
- Embedded DRAM & Flash
- SerDes
- ARM processors
Support of key applications such as:
- Mobile devices (smartphones, PDAs, GPS)
- Storage (disc drives, enterprise storage)
- Printers (ink jet, laser jet)
Advanced packaging & testing services featuring:
- System-in-Package (SiP)
- Fine-pitch BGA
- Flip Chip
Regional design centers help speed development |
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Toshiba offers a large family of application specific integrated circuit (ASIC) covers from ASIC 0.009µm (TC-300 family) to ASIC 0.3 µm (TC-220 family).
The TC300 family of ASICs are designed for the highest-performance, next-generation products ranging from networking and server applications to digital multimedia devices that manage audio/video information and portable devices that require the lowest power consumption. The TC300 family delivers approximately a 100% increase in gate integration, 20% increase is gate speed and a 50% reduction in power consumption compared to previous generation 130nm process technology. It's built on Toshiba's proven CMOS process technology (CMOS4) that permits easy mixing of mixed signal, DRAM and applications specific IP cores on the same chip. It supports two types of DRAM cores optimized for speed or density, Toshiba qualified primitives, I/Os and SRAMs, as well as a high-speed SerDes for a range of applications.
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