· Curent range 0.3 - 15A
· Voltage range 80V - 450V dc
· Available as C, L, and Pi circuits
· Bulkhead mounting
· Standard ranges for signal and power circuits
· Hermetically sealed
· Aerospace/avionics applications
LTCC is an alternative glass-ceramic multilayer substrate medium that incorporates conventional thick-film-material metal systems, providing a rugged, cost competitive substrate that can incorporate embedded passive components, along with more advanced devices such as flipchips and wire bonded bare die. Cavities can be configured in an LTCC substrate to provide controlled-impedance wire bond connections and packaging solutions.
