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Ferraz Shawmut Thermal Management is the expert in high-performance water cooling devices and systems.
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CPU Cooling Fans SAN ACE MC
Liquid Cooling System SAN ACE MC Liquid
SAN ACE MC Series is a low-noise, low-vibration cooling fan with superior head dissipation for efficient PC CPUs .
Sanyo Denki offers a complete product lineup of CPU coolers for Intel(R) Pentium(R) Processors. Please consult us for the latest models.
The SAN ACE MC Liquid Series is a high-performance liquid cooling system for CPUs with high clock speeds and extreme heat generation.
The device consists of a radiator, a reserve tank, a pump and a cooling fan.
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions.
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions.
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We can provide many kinds of heatsink for the thermoelectric cooling system and also can provide the custom design. Please do not hesitate to contact us if you have any requirment.
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Heat Sinks made of Molybdenum/Copper and Tungsten/Copper
Heat sinks made of WCu composites PLANSEE thermal management components have a thermal expansion matching that of packaging materials used in the electronics industry and show highest thermal conductivity.
Advantages:
* Highest thermal conductivity owing to the use of pure W and Cu without sintering additives
* Thermal expansion matching that of ceramic materials or semiconductor materials
* Cost savings at MoCu by stamping process at higher quantities
* Good machinability
Types of product:
* PLANSEE heat sinks galvanically plated with NiAu or electroless Ni plated
Forms of delivery:
Finished products:
* Heat sinks made of WCu and MoCu according to customers' drawings
Semi-finished products:
* WCu plates up to 100 x 100 mm with a thickness of 0.5 to 50 mm
* MoCu sheets up to 400 x 600 mm, to a thickness of 0.1 to 1.5 mm, and 400 x 400 mm to a thickness of 2 to 3 mm
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