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| Ferraz Shawmut Thermal Management is the expert in high-performance water cooling devices and systems. |
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions. |
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Tyco Electronics Thermal Solutions offers a complete line of heat sinks designed to meet Intel, AMD, and custom system architecture. Our active/passive heat sink designs encompass folded fin technology, extrusions, cold forged, and custom machined designs. In addition, we can embed heat pipes into custom applications.
We also offer our patented Chip Cooler design for lower wattage applications. This design incorporates a removable snap clip integrating a threaded radial or pin fin heat sink. The Chip Cooler product is fully re-enterable and includes the thermal interface material. We offer product "bundling" to include socket and thermal solutions as well as attachment hardware for all solutions. |
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| SUPERPOWER is a new series of high performance heat sinks created by Pada Engineering. This special technology allows for numerous possible solutions aiming at the dissipation of heat in electronic systems of any size and type using forced air. We suggest to have this new product in mind when you have to design medium-high power electronic systems, considering that the extreme versatility of its performances permits to raise its efficiency, money-saving, thermal characteristics, flexibility and, at the same time, reduction of weight, volume and costs. |
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Thermal Module (Type II) for BTX
Material: Frame, Impeller, Dust: Plastics Dust seal: Rubber sponge ; Heatsink: Aluminium(Core: Copper)
Life Expectancy: 40,000 hours, indoor environment (Survival rate: 90% at 60, rated voltage, and continuously run in a free air state)
Motor Protection System: Current blocking function and Reverse polarity protection
Dielectric Strength: 50/60Hz, 500VAC, 1 minute(between lead conductor and frame)
Operating Thermally Range: 0 to 70°C (Non-condensing)
Connector: Molex P/N 47054-1000 or Wieson 2510C888-001
Contact: Molex P/N 5159PBT or Equivalent or Wieson 2511-T1
For Intel 775-land LGA Package
Material: Frame,impeller: resin mold; Heatsink:aluminium(Core:copper)
Life Expectancy: 40,000 hours, indoor environment (Survival rate: 90% at 60, rated voltage, and continuously run in a free air state)
Motor Protection System: Current blocking function (with reverse polarity protection)
Dielectric Strength: 50/60Hz, 500VAC, 1 minute (between lead conductor and frame)
Operating Thermally Range: 0 to 70°C (non-condensing)
Connector: Molex P/N 47054-1000 or Wieson 2510C888-001
Contact: Molex P/N 5159PBT or Equivalent or Wieson 2511-T1
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| Pada Engineering has in its warehouse a full range of standard heat sinks for PCB. Models available in the several configurations are delivered according to detailed specifications in the attached technical drawings. In order to better match heat sinks with several electronic components, we are giving here a specific representation of the most famous and widespread devices, as well as the detailed description of the thermal characteristics proposed by each model. |
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| ... products without technical information |
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