Bond quality measuring system for wood-based panel industry GreCon

When producing wood-based panels, such as particle board, fibreboard, OSB, plywood and veneered panels, air voids and unbonded areas may occur. Depending on size and frequency, they can represent a loss in quality.
The GreCon Online Bond Analyser UPU 3000 inspects the panels and automatically assigns them to different quality classifications.
Furthermore, the Online Bond Analyser UPU 3000 is able to detect higher density fluctuations which are often an early indication of blisters. This enables the operator to rectify the production process to avoid the production of blisters and air voids and thus the production of bad panels.
In combination with the GreCon Thickness Gauge DMR 3000 and a board scale, GreCon offer the Online Bond Analyser UPU 3000 as quality assurance station.

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