Particle analyzer 3D PARTICLEVIEW

laboratorythicknesssemi-automatic

The 3D PARTICLE VIEW is a measuring unit for the obective assessment of the chip quality. The particle thickness is an important parameter for the mechanical characteristics of finished particleboards. The ratio of chip surface to volume is the decisive parameter for the effectiveness of glue application. Both parameters depend on the adjustment of the knife ring flaker and change through wear of the knife protrusion in the knife ring. Benefits at a glance - Measurement of entire chip geometry (length, width & thickness) - Specific adjustment of the knife protrusion of the knife ring flaker - Reduction of material loss by screening thanks to a specific change of the knife ring flaker - Saving of glue by reduction of the fine contents - Remote support with GreCon SATELLITE - Specific optimisation of the mechanical characteristics of the chipboard by production of the "optimal" chip geometry. MEASURING METHOD The particles to be measured that are taken preferably directly downstream to the knife ring flaker are measured by specially matched vibratory conveyors and automatically placed on the measuring conveyor belt. The conveyor transports the particles into the measuring area where length, width and thickness (height) of the particles are measured by a line laser including a camera unit. SOFTWARE FUNCTIONS AND VISUALISATION General The ergonomically designed software based on the Windows operating system allows the operator to easily use the system. The recorded measured values are processed and presented in a clearly structured manner.