Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at temperatures as low as 4K as an adhesive, sealant and protective coating, but more importantly, it is able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period). This optically clear, low viscosity epoxy bonds well to a wide variety of substrates including metals, glass, ceramics and many different plastics. The working life is long; a 100 gram mass will allow over 4-5 hours of working life. EP29LPSP has superior electrical insulation properties and a good chemical resistance profile. EP29LPSP requires gelling the mixed epoxy at room temperature, followed by alternative lower elevated temperature cure cycles (8-10 hrs @ 130(-150°F) or (5-7 hrs @ 175°F) or (3-5 hrs @ 200°F). EP29LPSP is widely used in applications requiring cryogenic service, optical clarity and NASA low outgassing properties.
