Heatsink for power electronics
D Series
Ohmite
Specifically designed for use with the increasingly popular TO-252, TO-263 and TO-268 packages, the D Series affords the user superior thermal performance over the more common stamped aluminum heatsinks. By eliminating the staking joint typically used in stamped heatsinks, the resulting air gap and thermal "bottle-neck" is also eliminated, while surface area for cooling is maximized with the extruded fins of the D Series body.








