Board-to-board connector SEARAY™ 0.80

SMTDINbackplane

These ultra high density, high speed open pin field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to .050" pitch SEARAY™ interconnects. With up to 500 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 10 rows and 50 contacts per row, choice of 7 mm or 10 mm stack height, and high speed 28+ Gbps performance.The socket is also available in right angle for micro backplane applications with optional guide posts for blind mating. Individual power modules with press fit tails provide a high power option for greater system flexibility. FEATURES 0.80 mm (.0315") pitch grid 50% board space savings versus .050" (1.27 mm) pitch SEARAY™ Performance: Up to 17.5 GHz / 35 Gbps Rugged Edge Rate® contact system Up to 500 I/Os 7 mm and 10 mm stack heights Solder charge terminations for ease of processing Samtec 28+ Gbps Solution Final Inch® certified for Break Out Region trace routing recommendations (Patent pending)