Electronics production machines

Designed to help you maximize efficiency, Leica DCM8 unites the advantages of High Definition confocal microscopy with interferometry into one versatile, dual-core system. Ultra-fast analysis is ensured thanks to one-click mode selection, ...

Speed matters in inspection, process control, or defect and failure analysis for the microelectronics and semiconductor industry. The faster you detect a defect, the faster you can react. 30% more field of view With a large field ...

Maximum temperature: 150 °C - 600 °C

SECO/WARWICK provides custom engineered aluminium coil and foil annealing furnaces with capacities ranging from single coil modular furnaces to multi-zone furnaces with tight zone control. We have the experience, knowledge and talent ...

SECO/WARWICK’s annealing furnaces exploit several different designs to ensure temperature uniformity. SECO/WARWICK holds patents for innovations on controlling airflow recirculation over various size loads, increasing heat transfer and ...

Maximum temperature: 150 °C - 1,350 °C

Pump down time to operational vacuum less than 15 min o Temperature uniformity better then +/-6 C | +/-10 F Meets requirements of AMS 2750E class 2 Efficient convection heating in lower temperatures Designed for hardening of tool and ...

AD1683 static eliminator, which incorporates a high-voltage power source, is a DC power-operated small-size device which can eliminate static electricity from charged objects without the need of an external high-voltage power source. ...

Resolution: 1 µm

The MX63 and MX63L microscope systems are optimized for high-quality inspections of wafers as large as 300 mm, flat panel displays, circuit boards, and other large samples. Their modular design enables you to choose the components you ...

X travel: 500 mm
Y travel: 500 mm

Feature: 1. High-quality laser beam, small focusing spots and well-distributed power. 2. High-pixel CCD camera makes automatic positioning, identification and feedback reporting come true. 3. Gantry structure and synchronous transmission ...

X travel: 250 mm
Y travel: 250 mm
Cutting speed: 0.001 m/s - 0.15 m/s

Features: 1. Fast speed 2. High processing quality 3. good beam quality 4. no mechanical stress 5. minimize the collapse and microcrack of chips 6. Low operating costs 7. 100, 000 hours average trouble-free operation 8. high electro-optic ...

Features: 1. high-quality UV cutting source 2. high cutting quality 3. high cutting reliability 4. small thermal affected zone 5. excellent cutting quality Parameters: 1. wavelength:355 nm 2. laser power:5 W 3. positioning ...

Motorized microscope with episcopic/diascopic illumination that enables control of objectives and light intensity from camera control unit and automatically detects observation method A manual microscope with episcopic/diascopic illumination, ...

Easy to operate Very good resolution at close and long range Dangerous induction voltages reliably discharged Test pulse up to 1,500 V for long distances For distances over 2,000 km Used together with a reflectometer, the ...

The Model CRD Semi-Automatic Dual Pin Inserter is based on SPIROLs standard Model CR design and is a very strong and stable dual vertical pin insertion machine. Able to install two pins simultaneously, it is ideally suited for moderate ...

The Model CR Semi-Automatic pin inserter is a robust, vertical pin-insertion machine that's ideally suited for moderate to high production for applications requiring up to 1,800lbs of installation force. A retractable pin orientation ...

SPIROL Model DP Drilling and Pinning Machine - This self contained machine is ideally suited for moderate to high production applications that require accurate drilling and pinning of assemblies. The concept of drilling and pinning with ...

The model 851 is a heavy duty EPROM eraser that can simultaneously erase up to 40 twenty four pin EPROM's. It is constructed of an all metal case plus an advanced designed chip drawer that prevents UV radiation from being a hazard to ...

Designed and built to Hitachi’s extraordinary standards, the Hitachi MC1000 Ion Sputter Coater is poised to perform in your lab for years to come. The MC1000 Ion Sputter Coater is a sample preparation instrument for use with a Scanning ...

Next generation devices at 20nm and below require double-patterning, 3D(three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech ...

Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal ...

X travel: 150, 65, 110 mm
Y travel: 150, 65, 110 mm

The integratable green laser head enhances the traceability of your parts with gentle marking that is suitable for plastics and reflective metals. COLD MARKING The 532nm wavelength allows marking without any significant heat release. MICRO ...

The compact manual fiber laser marking machine FOBA M1000 has been designed for the high-quality laser marking of small parts, medium sized components and work pieces and batches. Among others, the M1000 is ideally suited for laser marking ...

Introducing the Photoionizer which a latest version of an electrostatic remover that uses photoionization for generating a pure and efficient ions. The photoionization ability gives the product one step ahead among other product such ...

The L12542 is a newly developed electrostatic charge remover that makes use of VUV (vacuum ultraviolet) light. Due to its wide irradiation angle about 3 times larger than our current VUV light source, the L12542 efficiently removes electrostatic ...

Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi ...

Conductor Etch System M-8000 Series is utilized for hard mask and silicon etching for 32nm and beyond. Hitachi High-Tech developed new process flows, such as double patterning and new material etch processes such as high-k dielectric/metal ...

Conductor Etch System M-600/6000 Series is targeted for deep silicon trench etch of power devices used in mobile systems, home electrical appliances, automobiles, trains, etc. Low temperature etch technology and TM (Time Modulation) bias ...

X travel: 300, 200, 150, 110 mm
Y travel: 300, 200, 150, 110 mm

UV laser marking machine 355nm wavelength UV laser is the cooling laser which no damage on materials surface, it's suitable for all kinds of materials high precision and smooth marking. Introduction: Low Power DPSS UV Lasers(3W/5W/10W) ...

The placeALL®620 has a modular structure and can be used for the assembly of prototypes and small series. With a wide range of handled components, ranging from chips model 01005 up to FP-parts with a pitch of 0.3 mm and BGAs, even complex ...

The universal assemblystation MP904 combines the easy and flexible operation of a manipulator with the high standards of exact placing of Fine-Pitch components. The unrivalled smooth-running guide of the mounting head helps to place ...

The semi-automatic stencil printer printALL210 is solid constructed and the operating is simple. Set-up times are reduced to a minimum because tools aren't necessary. PCBs with max. size of 440 x 430 mm can be realized.

Semi-automatic printer for applying solder paste to the pads of printed circuit boards of various sizes Features • Microcomputer control, touch screen • Automatic height adjustment of squeegees relative to the stencil • Pressure ...

Automatic inline screen printer for applying solder paste to the pads of printed circuit boards Features • Servo drive cam • Servo drive Y axis raquel movement • Monitoring and adjustment of pressure squeegee in real time • Increased ...

The KAYO A8L is an automatic SMD report stations. Compact it can accommodate 70 tape feeders as well as 10 placement and positioning cameras. The placement accuracy is 0.01 mm for a placement capacity of 15000 components per hour(max) ...

MPS700 BOTTOM-SIDE SOLDERING ROBOT Our bottom-side soldering robot gives manufacturers the ability to solder problematic joints as part of their inline process – joints that normally need to be hand-soldered offline. The MPS700 is ...

MRC500 soldering robotic cell The MRC500 is the larger robotic cell that supports point to point iron soldering from above. The standardized platform is based on a flexible and modular concept that can be adapted to a range of processes ...

MRC500 laser robotic cell The laser MRC500 is the larger robotic cell that supports point to point laser soldering from above. The standardized platform is based on a flexible and modular concept that can be adapted to a range of processes ...

Rework at highest level Safe machining of large assemblies: ■1.800 W high-performance hybrid heating element ■Full-surface 6,400 W IR underheater ■High-resolution cameras for placement and process monitoring ■Computer-aided component ...

High-precision rework of fine pitch and chip components Technical Highlights: •High-precision axis system (X, Y, Z) and high-resolution cameras •Automated component placement as well as soldering and desoldering processes •Hybrid ...

Technical Highlights: •900 W Hybrid high-performance heating element •Full-area 1,600 W IR underheater •High-resolution cameras for placement and process monitoring •Ergonomically optimal system operation •Modern, user-friendly operating ...

Maximum temperature: 1,150 °C

Bath Automatic Line to perform heat treatment of steel components, can perform various processes as: normalizing, austenitizing, annealing, solubilization, tempering, quenching in different fluids (water, polymer, oil) and air quenching. ...

Maximum temperature: 1,200 °C

Batch Automatic Line to perform heat treatment of steel components, can perform various processes as: normalizing, austenitizing, annealing, solubilization, tempering and quenching in different fluids (water, polymer). Maximum batch weight ...

Maximum temperature: 1,150 °C

Heat treatment bogie hearth furnace. Heating is via high speed gas burners.

The CPC 100 + CP CU1 measure line impedances and k-factors on overhead lines and power cables. Ground impedances can also be determined on large systems with the CP CU1, as well as touch and step voltages. Mains frequency malfunctions ...

Plansee produces material for wear-resistant coatings, adhesive layers, decorative or DLC coatings. Offering compositions tailored for advanced hard coatings with optimized mechanical and tribological properties. Further topics that ...

Tungsten layers are components of the thin-film transistors used in TFT-LCD screens. They are used wherever large screen formats, particularly high image definition and optimized contrasts are needed. But tungsten is also used as a diffusion ...

Molybdenum sputtering targets are used for the manufacture of thin-film transistors used in TFT-LCD screens. Targets from Plansee are maximum dense, highly pure and show a homegenous microstructure. Therefore higher sputtering speeds, ...

Capacity: 7 l - 45 l
Maximum temperature: 1,100 °C

Definition: Electric chamber furnace for all applications. Construction: Robust construction made of bent plate. Vertical lifting front door. Insulation: Multilayer insulation. Interior in ceramic fibre and refractory bricks. Aeration: ...

Capacity: 55 l - 1,550 l
Maximum temperature: 600 °C

Product Description Construction: Mechanically welded frame. Racks according to model. Insulation: Multilayer insulation. Interior in ceramic fibre and refractory bricks. Aeration: Air intake and exhaust controlled by temperature controller. Heating: ...

Capacity: 10 l - 45 l
Maximum temperature: 1,200 °C

Definition: Electric chamber furnace for all applications. Construction: Robust construction made of bent plate. Vertical lifting front door. Insulation: Multilayer insulation. Interior in ceramic fibre and refractory bricks. Aeration: ...