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... materials. The APX300-S can process wafers used in the power devices, SAW filters, communication devices or MEMS sensor markets. Our Multi-Spiral Coil ICP (MS-ICP) source technology allows your operation ...
... The Edge Isolation + PSG Etching Inline System combines several process steps in one system with modular design. On the one hand the emitter layer on the rearside of the wafer generated during the diffusion ...
... TC‑SAW and nitride thickness adjustment (Si3N4).
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