Flexible printed circuit board

custom-madefor IoT applicationsfor electronics

Overview
Printed Electronics processes are used to produce flexible printed circuits by screen printing conductive silver-based paste onto PET (polyester) sheets. The polyester substrate provides flexibility that allows the circuit to conform to curved or irregular surfaces while maintaining electrical continuity, making these circuits suitable for compact assemblies and IoT (Internet of Things) integrations.

Main features

• Manufactured by Printed Electronics (screen printing) on PET (polyester) substrate.
• Conductive traces formed using a silver-based paste.
• Flexible circuits are protected by insulating layers offering high dielectric strength (>3750 V).
• Each PTF (Polymer Thick Film) can be supplied with adhesive on one or both sides.
• Connectors and cable terminations can be fitted according to customer requirements.
• Very low finished thickness (minimum 0.2 mm) with the ability to flex and bend without damaging the circuit.
• Compatible with multiple technologies for diverse applications.
• Suited for installations with limited space requiring signal or low-current transmission.

Technical specs

• Maximum dimensions: 1000 x 600 mm (custom sizes available on request).
• Adhesive application available using a selection of double-sided adhesives chosen per application.
• Wiring and termination options manufactured to customer specifications.
• Customer-specific design and layout services available.
• Substrate temperature limits:
  
  • Min: -40 °C
  • Max: 90 °C (continuous)
  • Max: 100 °C (short periods)
• Insulating layers provide high dielectric strength (>3750 V).
• Minimum finished thickness: 0.2 mm.

Notes

• Components are supplied as unfinished parts. Final conformity, marking and integration into an end product are the responsibility of the complete-unit manufacturer.

Specifications / technical data

• Manufacturing method: screen printing (Printed Electronics) on PET.
• Conductor: silver-based paste/mixture.
• Dielectric strength: >3750 V (insulating layer protection).
• Minimum thickness: 0.2 mm.
• Max dimensions: 1000 x 600 mm (customisable).
• Adhesive: optional, one or both sides; selection of double-sided adhesives per application.
• Wiring and connectors: configurable to customer specifications.
• Operating substrate temperature range: -40 °C to 90 °C continuous; up to 100 °C for short periods.
• Intended uses: compact signal and low-current transmission, IoT integration and other applications requiring ultra-flat, flexible circuits.