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Cathodic for thin-layer deposition sputtering target

Cathodic for thin-layer deposition sputtering target - Angstrom Sciences, Inc.
Cathodic for thin-layer deposition sputtering target - Angstrom Sciences, Inc.
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cathodic for thin-layer deposition

Description

PVD or Physical Vapor Deposition Materials comprise a range of materials that can be used to create thin film coatings. Angstrom Sciences offers a comprehensive selection of high-purity vacuum deposition materials including shown above. There are three factors that influence the quality and functionality of a film deposited by Physical Vapor Deposition (PVD): the quality and performance of the deposition source, the properties and structure of the deposition materials, and the intrinsic performance and layout of the deposition system and its’ associated peripherals. Angsstrom Sciences has the abilities and know how to control two of these three main factors. From sputtering targets of any size to materials used for thermal / e-beam evaporation, Angstrom Sciences has the ability to suggest and direct the most suitable materials for any application. Not all materials are equivalent in these processes as the chemical composition of the source material is only the starting point of a robust, application-specific process. Impurity levels, grain size, crystallographic structure/texture are but a few of the considerations that go into uniquely tailoring the structure of a suitable deposition structure. We draw from variety of specialized processing techniques such as Hot Pressing, Cold Pressing, Hot Isostatic Pressing (HIP), Cold Isostatic Pressing (CIP), Vacuum Induction Melting (VIM) and Vacuum Arc Casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards. All of our PVD materials are provided with a NIST traceable composition and impurity analysis.

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