Surface grinding machine IVG series

semi-automatichigh-precision1-axis

Semiautomatic single-axis grinding machine is a high-precision grinding machine with simple operation, abundant function and high cost performance, is equipped with automatic thickness measurement and compensation system in manual loading, can grind wafers to the required value automatically. The operating table can be customized according to customer requirements and has a wide range of applications. Complete function Automatic thickness measurement and compensation, multistage grinding program, waiting under overloading and other function, meeting various process requirements. Simple operation PC industrial computer system, touch screen control, one- button automatic grinding process in addition to manual loading and unloading. Good compatibility Operating table can be customized according to customer’s needs, can meet grinding and thinning process requirements of various semiconductor materials. Small floor space Minimize the floor space of clean room