The Rework System HR 100 uses the revolutionary and patented Ersa Hybrid Rework technology to safely desolder and replace small SMDs. The medium wave IR radiation combined with a gentle hot air jet guarantees optimal energy transfer to the component.
Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering
Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs
No blowing away of neighbouring components
Optionally available with stand, 800 W IR bottom heating and PCB intake
Optional mit Stativ, 800 W IR-Untenheizung und Leiterplatten-Aufnahme
Vac Pen for safe handling of devices
Operation software IRSoft
The Technology of Ersa Rework Systems sustainably secures the added value of electronics:
gentle heating technology
sensor guided soldering processes
contactless residual solder removal
precise component placement
complete process documentation
clear user guidance
Dimensions (W x D x H) in mm: 211 x 220 x 168
Weight in kg: 4.5
Antistatic Design (y/n): yes
Power Rating in W: 200
Nominal voltage in V AC: 230
Upper heating: 200 W (Hybrid Tool)
Component size in mm: 1 x 1 bis 20 x 20
Operation: One-touch operating button or Windows PC
Test symbol: CE
Hybrid Tool
Length in mm: Supply 1,350
Weight in kg: 0.3
Power Rating in W: 200
Antistatic Design (y/n): yes
HP 100 Heating Plate with Stand
Dimensions (W x D x H) in mm: 200 x 260 x 53,5
Weight in kg: 2,5
Antistatic Design (y/n): yes
Power Rating in W: 800