Multi-axis positioning system TELICA

portalfor the semiconductor industryhigh-accuracy

TELICA, a cutting-edge multi-axes platform, is revolutionizing semiconductor back-end applications with its dual gantry architecture, offering unmatched accuracy and throughput for advanced die bonding applications and more. TELICA is a multi-axes platform designed for semiconductor back-end applications, featuring a dual gantry architecture that offers motion along four degrees of freedom (X, Y, Z, and Rz) with a total of eight controlled axes. This advanced design supports demanding processes such as Flip-chip, Fan-out, Hybrid bonding, 2.5D/3D packages, µ-LED bonding, and dispensing applications. TELICA excels in both high positioning accuracy and high throughput, achieving ±1 µm global placement accuracy and ±350 nm local accuracy at a throughput of 10 kUPH for typical flip chip die bonding applications. For µ-LED bonding, it reaches up to 180 kUPH. TELICA introduces a novel metrology approach that significantly reduces the Abbé errors and the relative positioning mismatch between the process tool and substrate. Multi-dimensional encoders located at process plane level ensure precise placement, while water-cooled ironcore motors enable extreme duty cycles. Coupled with ETEL’s advanced AccurET controllers, TELICA benefits from features like zero settling time, advanced feedforward and trajectory filters, full synchronization of all axes with nanosecond jitter, and comprehensive software diagnostic and system identification tools for control optimization. Characteristics ±350 nm local placement accuracy (moves with local alignment) at 10 kUPH throughput. ±200 nm local placement accuracy (moves with local alignment) at 2 kUPH throughput.