Combined modules positioning system Z3TM+

5-axisautomaticfor wafer handling

The Z3TM+ is enlarging the portfolio of modules serving motion platforms. This module adds four independent degrees of freedom, namely Tip, Tilt, Theta and Z axes embedded inside an enlarged theta hollow shaft. One configuration includes a Z axis that now features a double stacked Z axis; one fine (FZ) and one coarse (CZ). By design, this optional module enables complete fulfillment of wafer motion profiles for advanced semiconductor applications, thus providing OEMs with a turn-key solution for any semiconductor technology. The product compactness establishes record density in terms of number of functions per volume, while its performance set new market standards for wafer level accuracies and dynamics. The Z3TM+ flexures based fine Z axis allows OEMs’ migration from expensive and obsolete piezoelectric solutions, eliminating their hysteresis problems while supporting nanometer level resolution, accuracy and repeatability, at even higher dynamics. With embedded support to proper sample alignment, the module then allows further control of wafers planarity, with respect to equipment heads, by means of its additional “tip” and “tilt” axes. Such unique functionality enables users with a next-level of process controls, for instance planarity, nominal Angle Of Incidence (AOI), focal plane straightness and many more, all of which result in unparalleled opportunity to yield wafer-level performance by the OEM technique.