8-axis positioning system TELICA

portalfor the semiconductor industry

TELICA is a multi-axes platform primarily dedicated to semiconductor back-end applications. Its dual gantry architecture provides motion along 3 degrees of freedom, X, Y and Z, for a total number of 8 controlled axes. It is designed to fulfill the most challenging requirements of advanced die bonding processes (Flip-chip, Fan-out, 3D stacked packages), µ-LED bonding, dispensing applications and more. By design, conventional motion system architectures are EITHER optimized for high positioning accuracy OR high throughput. Thanks to a very innovative motion system architecture, TELICA meets BOTH SIMULTANEOUSLY with ±1 µm global placement accuracy (blind move) at a throughput of 10 kUPH for a typical flip chip die bonding application and up to 180 kUPH for µ-LED bonding. TELICA is available in 2 standard variants: variant 1 for Wafer Level Packages (WLP) with X410 x Y445 x Z30 mm travels and variant 2 for Panel Level Packages (PLP) with X750 x Y800 x Z30 mm travels. TELICA introduces a new metrology approach drastically reducing the Abbé errors as well as the relative positioning mismatch between process tool and substrate. Multi-dimensional encoders ensure high placement accuracy while water cooled ironcore motors allow extreme duty cycles. Main specifications - ±350 nm local placement accuracy (moves with local alignment) - ±1 µm global placement accuracy (blind moves) - <10 minutes thermal transient (from cold start to hot working state) - Up to 10 kUPH throughput for a typical flip chip die bonding application - Up to 180 kUPH throughput for µ-LED bonding - Up to 4 g acceleration in X, 6 g in Y and 7.5 g in Z - Up to 2 m/s speed in X and Y and 1 m/s in Z