Wafer alignment system EVG®610 BA

for bondingR&DMEMS

The EVG610 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer a manual high-precision alignment stage with bottom-side microscope. The precision of EVG´s bond alignment system accommodates the most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications. Features Most suitable for EVG®501 and EVG®510 bonding systems Wafer and substrate sizes up to 150 / 200 mm Manual high-precision alignment stage Manual-operated bottom-side microscope Windows® based user interface Perfect multi-user concept (unlimited number of user accounts, various access rights, different user interface languages) Desktop system design with minimum footprint Supports IR alignment process Optimum total cost of ownership (TCO) for R&D and pilot line production Technical Data General system configuration Desktop System rack: optional Vibration isolation: passive Alignment methods Backside alignment: ± 2 µm 3 σ Transparent alignment: ± 1 µm 3 σ IR alignment: option Alignment stage Precision micrometers: manual Optional: motorized micrometers Wedge compensation: automated