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Spindle Analyzer diagnoses machine tool spindle error and is available in three models. The Dynamic model rapidly measures rotational error motion. Thermal model measures spindle stability of the machine in 5 degrees of freedom (X,Y,Z axis + pitch and ...
... EVG610 bond alignment system is designed for wafer-to-wafer alignment up to 150 mm wafer sizes. EV Group´s bond alignment systems offer a manual high-precision alignment ...
... ER-MNS-05A Dynamic Tracking MEMS north seeking system for drill rigs Introduction The ER-MNS-05A uses the latest MEMS gyro technology to achieve a perfect balance between size and ...
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