DescriptionThe LM901XL is 200 mm larger than the LM901 in both X and Y axes, extending the assembly area to process circuit boards up to 750 x 510 mm. It performs the complete dispensing and placement workflow, from solder-paste or adhesive application to placement of chip, fine-pitch and special components. The machine keeps the same placement throughput as the LM901 while accommodating larger PCBs and an increased placement envelope.
Technical Specifications and Product ComparisonLM901 | LM901XL
Placement rate: 300 - 600 SMDs per hour | Placement rate: 300 - 600 SMDs per hour
Dimensions: 700 x 680 x 340 mm | Dimensions: 900 x 880 x 340 mm
Max. PCB size: 550 x 310 mm | Max. PCB size: 750 x 510 mm
Max. placement area: 425 x 310 mm | Max. placement area: 625 x 510 mm
PCB thickness: 0.5 mm to ~4 mm | PCB thickness: 0.5 mm to ~4 mm
Characteristics / Technical specifications- Model: LM901XL
- Comparison: +200 mm in X and Y vs LM901
- Maximum PCB size: 750 x 510 mm
- Max. placement area (LM901XL): 625 x 510 mm
- Placement rate: 300 - 600 SMDs per hour
- Dimensions (LM901XL): 900 x 880 x 340 mm
- Processes: complete dispensing and placement workflow (solder paste or adhesive application to placement)
- Component types: chip, fine-pitch and special components
- PCB thickness: 0.5 mm to ~4 mm