BGA pick-and-place machine LM901

for single- or double-sided PCBSMTmanual

Product overview
The LM901 is the entry model of our modular pick-and-place systems. In addition to LM900 functionality, it can be extended with axis brakes, dispensers and optical support systems for component placement. It supports the complete dispensing and pick-and-place workflow, from applying solder paste or adhesive to placing standard, Fine-Pitch and BGA components.

Key features

• Extendable modular design: axis brakes, dispensers, optical support
• Supports dispensing and pick-and-place processes
• Placement rate: 300–600 SMDs per hour
• Suitable for standard, Fine-Pitch and BGA components

Applications

• Prototyping and product development
• Small-series assembly and laboratory production
• Board rework and component placement in electronics manufacturing

Technical specifications

• Model: LM901
• Dimensions: 700 x 680 x 340 mm
• Placement area (max): 425 x 310 mm
• Max. PCB size: 550 x 310 mm
• PCB thickness: 0.5 mm to ~4 mm
• Placement rate: 300–600 SMDs per hour

Product comparison
LM901 | LM901XL
Placement rate: 300–600 SMD/h | 300–600 SMD/h
Dimensions: 700 x 680 x 340 mm | 900 x 880 x 340 mm
Max. PCB size: 550 x 310 mm | 750 x 510 mm
Max. placement area: 425 x 310 mm | 625 x 510 mm
PCB thickness: 0.5 mm to ~4 mm | 0.5 mm to ~4 mm

Product video
Product video available (Vimeo).