Product informationThe placeALL®520 is a modular Pick&Place system for prototyping and small-series production. It handles a wide range of components (chips, fine-pitch components and BGAs). Intelligent software and up to 200 kitting slots minimize changeover time, increasing productivity for small lot sizes. The machine can be integrated inline or retrofitted with options on site.
Range of applicationsAssembly and dispensing for prototypes and zero/low-volume series, throughput up to 4000 components per hour.
Feeding unitsSupports feeding from tape, stick, tape strip, tray and loose components.
Component capabilityChips from 0201 up to fine pitch 70 × 70 mm (pitch 0.4 mm), BGAs, CSPs, µBGAs, QFNs and custom parts such as connectors and wired LEDs.
Technical data- 100 slots for 8 or 12 mm single-tape feeders
- Up to 200 positions for 8 mm tapes
- Up to 1 assembling head
- Up to 2 dispensing heads
- Optional dividable machine frame
- Maximum PCB size: 520 x 430 mm
- Platform dimensions (with feeder): 1820 x 1425 x 1570 mm
- Operation: standalone or inline
- Throughput: up to 4000 components per hour
Product comparison (excerpt)placeALL®520 | placeALL®620
100 slots for 8 or 12 mm single-tape feeders | 108 slots for 8 or 12 mm single-tape feeders
Up to 200 positions for 8 mm tapes | Up to 208 positions for 8 mm tapes
Up to 1 assembling head | Up to 2 assembling heads
Platform 1820 x 1425 x 1570 mm (with feeder) | Platform 2000 x 1500 x 1600 mm (with feeder)
4000 components per hour | 10500 (two heads) / 6000 (4600 / IPC9850) components per hour
Specifications- Model: placeALL®520
- Manufacturer: Fritsch GmbH
- 100 slots for 8 or 12 mm single-tape feeders
- Up to 200 positions for 8 mm tapes
- Up to 1 assembling head
- Up to 2 dispensing heads
- Optional dividable machine frame
- Maximum PCB size: 520 x 430 mm
- Platform dimensions (with feeder): 1820 x 1425 x 1570 mm
- Operation: standalone or inline
- Throughput: up to 4000 components per hour
- Feeding: tape, stick, tape strip, tray and loose components
- Component capability: chips 0201 up to fine pitch 70 × 70 mm (pitch 0.4 mm), BGAs, CSPs, µBGAs, QFNs, custom parts (connectors, wired LEDs)