Residual gas analysis systems for vacuum process analysis
The HPR-30 Series are residual gas analysis systems configured for analysis of gases and vapours in vacuum processes and for vacuum diagnostics with sampling capability from high vacuum to atmospheric pressure. The systems are fully configurable for individual process applications such as CVD, ALD, plasma etching, MOCVD, process gas purity and in-process contaminant monitoring.
Plasma characterisation
Freeze drying
CVD / MOCVD / ALD
Vacuum processing
Residual gas analysis
Near atmospheric XPS, APXPS
Thin film optical coating
The HPR-30 Series systems are designed for fast response high sensitivity analysis of gas and vapour species in vacuum processes. Applications include leak detection, contamination monitoring, process trend analysis and analysis of high mass species and precursors used in ALD and MOCVD applications for example.
Sampling configurations are offered as:
HPR-30 cart with dual conductance sampling inlet features a close-coupled re-entrant aperture for sampling directly within the process region, providing maximum data integrity and fast confirmation of process status.
HPR-30 Multi inlet cart with multiple flexible inlets, 1m long and tri-valve manifold connection with automated switching for analysis over a broad process pressure range.
HPR-30 SGL with a single heated sampling line for applications where there is limited tool space for sampling connection, and where the requirement for analysis of less volatile reaction products requires a fully heated inlet solution. Time resolved data acquisition suited to pulsed deposition process monitoring is offered as a system option.