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Process monitoring gas monitoring equipment LG-100 Series
for detectionfor production linesfor analysis

Process monitoring gas monitoring equipment - LG-100 Series - HORIBA STEC - for detection / for production lines / for analysis
Process monitoring gas monitoring equipment - LG-100 Series - HORIBA STEC - for detection / for production lines / for analysis
Process monitoring gas monitoring equipment - LG-100 Series - HORIBA STEC - for detection / for production lines / for analysis - image - 2
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Characteristics

Technical applications
for process monitoring, for detection, for production lines, for analysis, for industrial use

Description

Overview
Laser gas analyzer LG-100 Series performs real-time measurement of partial pressure changes of silicon tetrafluoride (SiF4) produced during etching processes in semiconductor manufacturing. These measurements enable endpoint detection and reduce the risk of under-etching or over-etching, improving productivity and yield.

Technology and application
LG-100 Series integrates HORIBA's IRLAM™ (Infrared Laser Absorption Modulation) infrared gas analysis technology. IRLAM enables highly sensitive measurements of trace gases at ppb levels with fast response times of approximately 0.1 second. The analyzer supports multi-component gas analysis and fast response suitable for advanced logic semiconductor etch processes and non-plasma applications.

Key features
  • High-sensitivity, high-speed measurement of exhaust components generated by etching processes
  • Endpoint detection via changes in gas composition (SiF4 monitoring)
  • Designed for non-plasma etch process monitoring
  • IRLAM™ enables trace gas detection at ppb levels with ~0.1 s response

Benefits
Real-time partial pressure monitoring provides precise endpoint detection during etching, minimizing under- and over-etching and supporting higher manufacturing yield. Fast, sensitive multi-component analysis addresses control needs for modern 3D semiconductor structures and supports diverse process requirements.

Manufacturer / Classification
Manufacturing Company: HORIBA STEC, Co., Ltd.
Segment: Semiconductor
Division: Dry Process Control

Characteristics / Technical specifications
  • Measured gas example: silicon tetrafluoride (SiF4) — partial pressure monitoring in gas mixtures
  • Measurement principle: Infrared Laser Absorption Modulation (IRLAM™)
  • Sensitivity: ppb-level trace gas measurement (IRLAM capability)
  • Response speed: approx. 0.1 second
  • Primary application: real-time endpoint detection during etching processes
  • Functionality: multi-component gas analysis, fast response for process monitoring
  • Intended use: advanced logic semiconductor manufacturing; non-plasma applications

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