Exhibit with us
*mydirectindustry  
English
  1. Electricity - Electronics
  2. Electronic Component
  3. Bonding resin
  4. Huntsman Advanced Materials
video corpo

Polyurethane resin I-BOND®
compositefor bondingfor wood

Polyurethane resin - I-BOND® - Huntsman Advanced Materials - composite / for bonding / for wood
Polyurethane resin - I-BOND® - Huntsman Advanced Materials - composite / for bonding / for wood
Polyurethane resin - I-BOND® - Huntsman Advanced Materials - composite / for bonding / for wood - image - 2
Polyurethane resin - I-BOND® - Huntsman Advanced Materials - composite / for bonding / for wood - image - 3
Polyurethane resin - I-BOND® - Huntsman Advanced Materials - composite / for bonding / for wood - image - 4
Polyurethane resin - I-BOND® - Huntsman Advanced Materials - composite / for bonding / for wood - image - 5
Add to favorites
Compare this product

Characteristics

Type
polyurethane
Applications
composite, for bonding, for wood

Description

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast-curing resins for the composite wood panel industry. They are used for bonding: Oriented Strand Board (OSB) Medium Density Fiberboard (MDF) Particleboard (PB) Wood Fiber Insulation Board (WFI) I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant. I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.

VIDEO

Catalogs

Other Huntsman Advanced Materials products

Products

*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.