Temperature measurement system HighTemp™

for wafers

The HighTemp™ series of in situ wafer temperature measurement systems, available in both 300mm and 200mm configurations, is designed to optimize and monitor advanced film processes (FEOL and BEOL ALD, CVD and PVD) and other elevated temperature processes. HighTemp wireless wafers measure process tool thermal uniformity, providing a complete picture of temporal and spatial temperature data collected in real-time under actual production process conditions. By revealing thermal variations in applications such as plasma environments that can affect process windows and patterning performance, the HighTemp series helps IC manufacturers optimize the integration of new materials, transistor technologies and complex patterning techniques. Applications Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching Temporal and spatial temperature data under real process conditions for characterization of advanced film processes with temperatures in the range 20-400°C. Temporal and spatial temperature data under real process conditions for characterization of advanced film processes with temperatures in the range 20-500°C. Additionally, HighTemp-500 extends the maximum data collection capability (time at temperature) for processes up to 400°C when compared to HighTemp-400.