The UV Wafer™ in situ ultraviolet (UV) light 300mm measurement system utilizes wireless sensor wafer technology to measure UV light dosage and intensity at the wafer surface within film deposition process tools. Enabling previously unavailable process optimization and monitoring, the UV Wafer provides temporal and spatial information on the intensity of light reaching the wafer surface from the UV lamp used to anneal or cure FCVD (flowable) oxides and low k dielectric films. The UV Wafer can also identify lamp age-induced drift or other changes in the lamp intensity that result in non-uniform film properties. By highlighting optics system issues within the UV lamp subsystem, the UV Wafer helps engineers drive process tool improvements that result in optimal curing processes.
Applications
Process development, Process qualification, Process tool qualification, Process tool monitoring, Process tool matching
Film deposition, UV curing, UV anneal | UV Wafer height with sensor module is either 4mm or 6mm