Printed circuit board microphone SiSonic™
MEMSultrasonicsurface

printed circuit board microphone
printed circuit board microphone
printed circuit board microphone
printed circuit board microphone
printed circuit board microphone
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Characteristics

Applications
for printed circuit boards
Technology
MEMS, ultrasonic, surface
Polar pattern
omnidirectional
Other characteristics
digital, wide-band

Description

We are the world leader in MEMS microphones across the Mobile, Ear, and IoT markets and have shipped more than 15 billion units to date. Design variables include ever-smaller sizes, lower profiles and mounting options, increased output capacities, and new digital audio options that eliminate analog noise. For manufacturers, surface mount designs eliminate off-line subassembly production costs. Customized designs are supplied on tape-and-reel and can be run through standard automatic pick-n-place equipment during in-line surface mount manufacturing. The microphone can also communicate with our IntelliSonic™ software and special porting designs to provide a precisely customized sound. New MaxRF models eliminate GSM/TDMA burst noise and provide wide-band RF noise suppression UltraMini footprint - less than 11.5mm Slim UltraMini footprint - less than 8.5mm Digital mics eliminate analog noise Integrated designs with differential or switchable gain Bottom port for thinnest ever designs Multiple performance modes (sleep, low-power, standard mode) optimize voice-trigger applications by entering a low-power high-SNR sensing mode
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.