Intel dual Xeon-D processors enable high density computing with exceptional power efficiency
Specifications
Dual Intel Xeon D
576 vCPU in 2U at 21” depth
Support for SRIOV, DPDK and 6WIND
2x Logical IPMI interface for transparent OpenStack discovery
40Gbps network bandwidth per server, up to 18 servers per 2U
600Gbps full duplex total bandwidth in 2U
On board TPM
The MSP8060 Series of modular servers enables high density computing that allows a large amount of VNFs to run simultaneously on a single platform and reduce operating costs. The MSP8060 is a key modular unit that can be supported within any SYMKLOUD MS2900 or MS1300 Series enclosure to give operators the ability to mix and match various hardware technologies. Its main use cases involve intelligent edge computing services which include virtual network functions (VNFs) for vBBUs and vRAN, among others.