Epoxy resin LYK

hot mountinglow-viscosity

Product introduction
Cold mounting compounds are formulated for embedding specimens that cannot withstand elevated temperature or pressure. Available as epoxy or acrylic systems, these materials offer variants for rapid curing, low exotherm, low viscosity for enhanced penetration, and fully transparent, bubble-free results where required. Formulations are based on environmentally acceptable resins and designed for straightforward mixing and use in metallography and electronics microsectioning.

Key features

• Options for rapid curing or extended working time
• Low-exotherm grades to minimize thermal stress on sensitive samples
• Low-viscosity grades for superior permeability into fine structures
• Transparent, bubble-free formulations for clear imaging
• Suitable for specimens sensitive to heat and pressure (metallographic samples, PCBs, SMT assemblies)

Buying guide
Name | Model | Packaging | Application
Cold-Inlaid King | LYK | 1000 g cold-setting powder, 800 ml curing agent, one φ30 cold-mount mold, 20 plastic cups, 40 stirring rods, 1 spoon. | Fast embedding, good transparency, low viscosity, high strength; for metalworking where heat/pressure or mounting equipment are not used. Curing: 25°C, ~25 minutes. Mix ratio (weight): powder 5 : curing agent 4.
Epoxy King | HSK | 1000 ml resin, 500 ml curing agent, one φ30 cold-mount mold, 20 plastic cups, 40 stirring rods. | Rapid-curing, fully transparent; for heat-sensitive samples and PCB/SMT microsectioning without mounting equipment. Curing: 25°C, ~1 hour. Mix ratio (volume or weight as supplied): resin 2 : curing agent 1.
HSN | HSN | 1000 ml resin, 500 ml curing agent, one φ30 cold-mount mold, 20 plastic cups, 40 stirring rods. | Low-viscosity, high permeability, transparent; for microsections of samples that cannot be heated (e.g., PCBs, SMT components). Curing: 25°C, ~3–4 hours. Mix ratio: resin 2 : curing agent 1.
HSM | HSM | 1000 ml resin, 300 ml curing agent, one φ30 cold-mount mold, 20 plastic cups, 40 stirring rods. | Low-heat generation, minimal shrinkage, transparent; for sensitive microsection mounting without heating or mounting presses. Curing: 25°C, ~20–24 hours. Mix ratio: resin 3 : curing agent 1.

Characteristics / technical specifications

• Product family: Cold mounting compounds based on epoxy or acrylic resins
• Material: Environmentally acceptable epoxy or acrylic resins; non-toxic under normal use
• Typical applications: Metallographic sample preparation; mounting heat-sensitive specimens; PCB and SMT assembly microsectioning
• Available grades: LYK (cold-setting powder kit), HSK (fast-curing epoxy), HSN (low-viscosity epoxy), HSM (low-heat epoxy)
• Typical packaging: Resin and curing agent kits with φ30 cold-mount mold, plastic cups, stirring rods and accessories
• Curing conditions (typical at 25°C): LYK ~25 min; HSK ~1 h; HSN ~3–4 h; HSM ~20–24 h
• Mixing ratios (typical): LYK powder:curing agent = 5:4 (weight); HSK resin:curing agent = 2:1; HSN resin:curing agent = 2:1; HSM resin:curing agent = 3:1
• Performance notes: Select low-viscosity grades for fine-structure penetration; select low-exotherm grades to protect temperature-sensitive specimens