Hot air rework station MS8800

for BGA

1. Creating heating temperature profile for a wide variety of devices. Replaying the created temperature profile data, as a result the target device can be removed or installed easily and with high accuracy. It also comes with an analysis function that can check the peak temperature, retention time, cooling, etc. 2. Support size Devices：Max 50mm 　　 PCB：400×400mm、Weight Max10kg 3. High-precision alignment(Manual) Accurate alignment can be done with image synthesis using prism. 4. Nozzle installation. One-touch type allows exchange of nozzles can be done easily. 5. Built-in brushless fan. No need for an external air supply that making this MS8800 Rework station easy to install and operate.