Hot air rework station MS9000XL

automaticsemi-automaticfor PCB

Product overview
Support for large, multilayer and heavy PCBs. Next-generation rework technology integrating component removal, cleaning and precise re-placement.

Main features

• Supports large, multilayer and heavy PCBs up to 650×700 mm
• Simultaneous component removal and thermal profile acquisition via ITTSⅡ
• Automatic high-precision alignment with Visual Move (patented), repeatability ±25 μm
• Optional non-contact cleaning unit with automatic Z-gap correction
• High-efficiency dual heating system: hot-air upper cartridge (~1.04 kW) and far-IR lower heater (~8.0 kW)
• High-precision re-placement with dedicated fixtures (Sand Dip tool); supports bump printing and transfer
• Expandable: chip unit option, external 5.0 Mpx motorized-zoom camera, recording functions
• Integration-ready with inspection equipment (visual aid, AOI) for automated workflows

Functional details

• Large/multilayer/heavy board support
  - PCB size X max 650 mm, Y max 700 mm; min 50 mm (5–40 mm option); standard board weight up to 10 kg; thickness ~10 mm (up to ~20 mm with clamp option)
• Simultaneous removal & thermal profiling
  - Automatic temperature-tracking ITTSⅡ allows removal and profile capture in parallel; typical operation ~15 minutes by non-specialist
• High-precision alignment
  - Visual Move visual-loop alignment merges board and component images to confirm diagonal points for semi-auto positioning
• Cleaning (option)
  - Non-contact cleaning unit with automatic path and Z correction for suction nozzle
• Heating system
  - Upper: hot-air cartridge heater ~1.04 kW (exchangeable with mid-IR unit); Lower: far-IR heater ~8.0 kW (coverage 640×700 mm); local heating plate option available; air flow manual via flowmeter; up to 6 thermocouples usable
• Re-placement
  - Dedicated fixtures for precise placement; supports Sand Dip, mask-bump printing and transfer methods

Technical specifications

• PCB: X max 650 mm, Y max 700 mm, Z up to ~10 mm (up to ~20 mm option); upper clearance 65 mm; lower clearance max 50 mm
• Component: XY max 150×140 mm; chip unit option supports 0402–0603
• Heaters: upper hot-air cartridge ~1.04 kW; lower far-IR ~8.0 kW (640×700 mm); local heating plate option; air flow manual; user-usable thermocouples: 6
• Placement accuracy: repeatability ±25 μm
• XY table: Y-rail clamp; backup pins large/small 6/6; clamps for irregular boards and high-strength clamps 10 mm
• Camera: 5.0 Mpx motorized zoom, prism spectral type; Visual Loop semi-auto alignment
• Monitor / Software: 24-inch LCD; dedicated software (Windows 10); user data storage per PCB/package (SSD ≥128 GB)
• Machine: W ≈1850 mm × D ≈970 mm × H ≈1750 mm; weight ≈230 kg; Power: 3-phase AC 200–230 V 50/60 Hz (max 10 kW, 60 A)
• Air: dry air 0.5–0.8 MPa (recommended compressor >2.1 kW, 220 l/min)

Notes

• Specifications and appearance are subject to change without notice.