Hot air rework station MS9000XL

automaticfor PCB

Product overview
Support for large, multilayer and heavy PCBs. Integrated next-generation rework technology for removal, cleaning and re-placement of components.

Main features

• Compatible with large, multilayer and heavy PCBs
• Simultaneous component removal and temperature profile acquisition
• Highest-precision alignment using Visual Move (patented)
• Advanced non-contact cleaning system (optional)
• High-efficiency heating system with configurable upper/lower heaters (options available)
• High-precision component re-placement using dedicated jigs
• Extensive expansion options (chip unit, external camera, etc.)
• Comprehensive support and automatic integration with inspection and production equipment

Functional details

• Large, multilayer and heavy board support
  - Supported PCB size: X up to 650 mm, Y up to 700 mm; minimum 50 mm (5–40 mm available as option)
  - Standard maximum board weight: 10 kg
  - Supported component sizes: 0402 to 150 × 140 mm
  - Supported thickness: standard up to ~10 mm (up to ~20 mm with optional clamp modification)
  - Suitable for large server and base-station PCBs
• Simultaneous component removal & temperature profile acquisition
  - Uses automatic temperature-tracking system ITTSⅡ (in-house) to perform removal and profile capture concurrently
  - Operation skill level: typically completable in ~15 minutes by non-specialist operators
• Highest-precision alignment
  - Automatic alignment system Visual Move (patented)
  - Repeat placement accuracy: ±25 μm
  - Alignment procedure: composite view of PCB and component images to confirm diagonal points, then click each diagonal point to complete (visual loop method)
• Cleaning system (optional)
  - Non-contact cleaning unit available
  - Automatic Z-axis clearance correction between suction nozzle and PCB
  - Automatic cleaning by defining target areas and cleaning path
• Heating system
  - Upper: hot-air cartridge heater approx. 1.04 kW (1040 W) — interchangeable with mid-IR IR heater unit (option)
  - Lower: far-infrared IR heater approx. 8.0 kW (coverage 640×700 mm) — local heating plate available as option for targeted heating
  - Airflow: manual adjustment via flowmeter
• Re-placement (soldering)
  - High-precision re-placement using dedicated jig (Sand Dip tool)
  - Supports both bump printing and transfer methods
• Expansion options
  - Chip unit for chip-component rework (optional)
  - External camera: 5.0 Mpx, motorized zoom, capture/record functions (optional)
• Equipment integration
  - Supports automated linking with visual inspection aids, AOI and other inspection systems (proven integrations)

Technical specifications

• PCB: X (length) max 650 mm, min 50 mm (5–40 mm optional)
  Y (width) max 700 mm, min 50 mm (5–40 mm optional)
  Z (thickness) up to ~10 mm standard (up to ~20 mm with option)
  Top usable clearance above PCB: 65 mm
  Bottom usable clearance under PCB: max 50 mm (fixed options 50–20 mm)
• Device: max XY size 150 × 140 mm (supports visual-loop alignment)
  Chip-unit option supports 0402–0603
• Heaters: Upper hot-air cartridge heater approx. 1.04 kW (1040 W)
  Lower local heating via optional plate available
  Area heater: far-IR heater approx. 8.0 kW (coverage 640×700 mm)
  Airflow control: manual via flowmeter
  Thermocouple channels: up to 6 usable by user
• Component placement: repeat placement accuracy ±25 μm
  Cream solder printing methods: Sand dip, mask bump printing and transfer (concave 250 μ + 150 μ)
• XY table: PCB clamping Y-rail clamp (special clamps for irregular boards: 6 board clamps / 6 high-strength clamps 10 mm)
  PCB backup: two types of backup pins (6 large / 6 small)
• Camera: 5.0 Mpx motorized zoom, prism spectral type
  Image splitting: Visual Loop auto-alignment (semi-auto)
• Monitor / Software: 24″ LCD for operation
  Dedicated software (Windows 10 OS)
  User data storage: save per PCB/package combination (SSD >=128 GB)
  Semi-auto alignment: pattern matching for XYZθ automatic alignment
• Machine dimensions, weight, power: W ≈ 1,850 mm × D ≈ 970 mm × H ≈ 1,750 mm
  Weight ≈ 230 kg
  Power: 3-phase AC 200–230 V 50/60 Hz (max 10 kW, 60 A)
• Air supply: Dry air 0.5–0.8 MPa (recommend >2.1 kW compressor, 220 l/min)
• Note: Specifications and appearance subject to change without notice.