Hot air rework station MS9000XL-D

automaticsemi-automaticfor PCB

Application
　Large, multilayer and heavy PCB rework — component removal, cleaning, and high 　precision re placement in one integrated system.

Differentiation
• Dual process automation: simultaneous component removal and temperature profiling (ITTSⅡ).
• Skill free alignment using patented Visual Move (±25 μm repeat accuracy).
• Non contact cleaning with automatic Z clearance control.
• High efficiency heating with configurable upper/lower heaters (hot air / IR).
• Full integration with inspection and production equipment (AOI, visual aids).
• Extensive expansion options: chip unit, external camera, dedicated re placement jigs.

Key Specifications
• PCB size: up to 650 × 700 mm
• Board weight: up to 10 kg
• Component size: 0402 to 150 × 140 mm
• Board thickness: ~10 mm (up to ~20 mm with optional clamp)
• Lower heater power: 8.0 kW (640 × 700 mm coverage)
• Upper heater: 1.04 kW hot air (IR option available)
• Alignment accuracy: ±25 μm
• Typical operation time: ~15 minutes by non specialist operators
• Camera option: 5.0 Mpx, motorized zoom, capture/record


Notes

• Specifications and appearance are subject to change without notice.