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BGA rework station Rebcom RBC-1 ver.2
for SMD

BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD
BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD
BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD - image - 2
BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD - image - 3
BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD - image - 4
BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD - image - 5
BGA rework station - Rebcom RBC-1 ver.2 - MEISHO - for SMD - image - 6
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Go to the MEISHO website for more information

Characteristics

Applications
for BGA, for SMD

Description

Application

Manual rework system that enables high precision solder paste printing and reballing with a single unit. Ideal for component replacement, BGA reballing, and pad to stencil alignment during rework.


Differentiation

  • One Touch Alignment Mechanism (Patented) The patented mechanical alignment system uses two diagonal guide pins and matching guide holes on all accessories, enabling precise pad to stencil alignment in X/Y/Z/θ without the need for fine adjustment.

  • High precision micro adjustment when needed XYZθ fine adjustment: 0.5 mm per 360° knob rotation, allowing precise manual tuning when required.

  • Digital Z axis gauge Displays the exact contact and release points between the component and stencil — the key factor for successful reballing.

  • Vacuum holding structure Keeps components firmly fixed after centering for stable printing and reballing.

  • Unified accessory interface Printing masks, reballing masks, and the Centering Tool all use the same diagonal guide pin system for repeatable positioning.

  • Clean and safe operation Excess solder balls are collected via vacuum tube into a glass bottle.


Key Specifications
  • Patented one touch positioning mechanism (Patent No. 6156738)
  • Digital Z axis gauge for accurate stencil contact control
  • Vacuum holding for stable component fixation
  • Compatible masks for printing and reballing with diagonal guide holes
  • Fine adjustment: 0.5 mm per full rotation (XYZθ)
  • Clean solder ball collection via vacuum tube

VIDEO

Catalogs

RBC Series
RBC Series
4 Pages
Go to the MEISHO website for more information

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.
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