Non-contact dimensional inspection system NEXIV VMZ-H3030

Overview
The NEXIV VMZ-H3030 from Nikon is a high-precision video measuring system designed for fast, accurate dimensional and height measurement of components. It features a 300 × 300 × 150 mm XYZ measuring envelope and is supplied with high-quality optical zoom heads and a TTL (through-the-lens) scanning laser autofocus as standard.

Product highlights

• Measuring envelope (X, Y, Z): 300 × 300 × 150 mm.
• TTL through-the-lens scanning laser autofocus included for high-speed height measurement (up to 1,000 points/s).
• Five optical zoom head options (Type 1–4 and TZ) to cover different fields of view and resolution needs.
• 8-segment ring illumination with three incidence angles plus episcopic/diascopic/darkfield modes depending on head type.
• Non-stop automatic measurement workflow to maintain accuracy despite sample positioning variations.

Core features

• High-speed height scanning: TTL laser autofocus capable of 1,000 points per second for rapid Z-data acquisition.
• Detection of thin transparent layers (down to ~0.1 mm) using the TTL laser autofocus.
• Multiple illumination modes (episcopic, diascopic, darkfield, segmented ring) to support measurement of difficult edges and features.
• Camera options: VGA 1/3" B/W standard; color camera optional for Types 1, 2 and 3.

Zooming heads (summary)
Type 1 — Optical magnification: 0.5X–7.5X — FOV: 9.33×7.01 ~ 0.622×0.467 mm — Applications: molds, mechanical parts (household, automotive), PCB, electronic parts.
Type 2 — Optical magnification: 1X–15X — FOV: 4.67×3.5 ~ 0.311×0.233 mm — Applications: molds, mechanical parts, PCB, electronic parts.
Type 3 — Optical magnification: 2X–30X — FOV: 2.33×1.75 ~ 0.155×0.117 mm — Applications: electronic parts.
Type 4 — Optical magnification: 4X–60X — FOV: 1.165×0.875 ~ 0.078×0.058 mm — Applications: high-density package substrates (line, width, height).
Type TZ — Optical magnification: 1X–120X — FOV: 4.67×3.5 ~ 0.039×0.029 mm — Applications: wafer patterns (WLP, bump height, rewiring mask, MEMS mask).

Illumination (summary)
Types 1–3: episcopic, diascopic and 8-segment ring with three incidence angles (white LEDs). Type 4: episcopic, diascopic, 8-segment ring (one angle). Type TZ: episcopic, diascopic, darkfield.

Technical specifications

• XYZ strokes: 300 × 300 × 150 mm.
• Minimum readout: 0.01 μm.
• Maximum sample weight: 30 kg (accuracy guaranteed up to 10 kg).
• Maximum permissible error (for samples under 20 kg): EUX,MPE / EUY,MPE: 0.6 + 2L/1000 μm; EUXY,MPE: 0.9 + 3L/1000 μm; EUZ,MPE: 0.9 + L/150 μm.
• Accuracy guaranteed temperature: 20 °C ± 0.5 K.
• Maximum driving speed XY, Z: 100 mm/s, 50 mm/s. Minimum driving speed XY, Z: 0.01 mm/s, 0.001 mm/s.
• Autofocus: Vision AF and Laser AF (TTL laser autofocus standard).
• Power: AC 100–240 V ±10%, 50/60 Hz. Power consumption: 5 A–2.5 A.
• Dimensions (main body with table): 1000 × 1125 × 1750 mm / approx. 500 kg. Controller: 190 × 450 × 440 mm / approx. 15 kg. Footprint (WxD): 3000 × 2800 mm.