Critical dimension measuring system NEXIV VMF-K series

distancedimensionaloptical

Overview
Nikon's NEXIV VMF-K Series is a confocal video measuring system combining high-speed 2D imaging and confocal height (3D) measurement within a single field of view. The system is intended for semiconductor and precision engineering workflows such as probe card inspection, wafer-level packaging (WLP), substrate production and other miniaturised-component inspections.

Key benefits

• Higher throughput: approx. 1.5× improvement vs previous models for combined 2D and height measurements.
• Simultaneous 2D bright-field imaging and confocal height measurement in one workflow, reducing inspection time.
• Green LED confocal light source with long life (~30,000 hours) replacing xenon for improved serviceability and stability.
• Stable measurement on high-contrast, highly reflective and highly transparent/thin samples.
• Support for long-dimension measurements (beyond single field of view) and coordinate-based measurement strategies.

Product highlights

• Integrated 2D bright-field optics with motorised 5-step zoom plus confocal height measurement for fine structures.
• Standard 45× high-magnification head for ultra-fine semiconductor features (sub-2 µm).
• LED illumination: White LED for bright-field, Green LED for confocal height scans.
• Autofocus options: TTL Laser AF and Image AF.
• Improved usability features: easier headcover removal and front-head LED status indicator.

Models and application areas
The NEXIV VMF-K family addresses multiple stroke sizes and production needs:

• NEXIV VMF-K3040 — XYZ strokes 300 × 400 × 150 mm: medium-stroke applications such as probe card inspection.
• NEXIV VMF-K6555 — XYZ strokes 650 × 550 × 150 mm: larger stroke and table capacity for substrates, larger wafers and bigger probe cards.

Representative use cases

• Probe card inspection: simultaneous 2D/height capture in a single FOV and higher throughput for contact verification and tip measurement.
• Wafer inspection and WLP: 45× objective supports ultra-fine feature metrology; confocal height handles reflective and transparent layers.
• Substrate production and precision QA: reliable measurement of thin/transparent samples and long-dimension coordinate measurements.

Notes on optics and measurement approach
The system combines bright-field 2D imaging and confocal height scanning in one measurement flow. Confocal height scanning supports a maximum scan height of 1 mm. Bright-field optics use a motorised 5-step zoom to cover a wide range of fields of view and magnifications. The confocal path provides high height resolution and repeatability suitable for demanding 3D inspection tasks.

Technical specifications (selected)

• Series name: NEXIV VMF-K Series
• Measuring head options: Standard head (Type-S), High-magnification head (Type-H), 45× high-magnification head
• Optical magnifications (examples): 1.5×, 3.0×, 7.5×, 15×, 30×, 45×
• Working distances (examples): 24 mm (1.5×/3.0×), 5 mm (7.5×/30×/45×), 20 mm (15×)
• Confocal maximum scan height: 1 mm
• Confocal field of view examples: 7.80×5.82 mm → 0.26×0.19 mm (varies with head/magnification)
• Height measurement repeatability (2σ) examples: 0.6 µm, 0.35 µm, 0.25 µm, 0.20 µm (depending on magnification/head)
• Height resolution: typical 0.025 µm; down to 0.01 µm in high-resolution modes
• Light sources: Confocal = Green LED; Bright-field = White LED
• Autofocus: TTL Laser AF and Image AF
• Power: AC 100–240 V ±10%, 50/60 Hz; power consumption approx. 3–5.5 A (model/config dependent)
• Representative models & strokes: VMF-K3040 = 300×400×150 mm; VMF-K6555 = 650×550×150 mm
• Accuracy guaranteed loading capacity: VMF-K3040 ≈ 20 kg; VMF-K6555 ≈ 30 kg
• Minimum readout / digital resolution: 0.01 µm
• Recommended installation footprint (examples): VMF-K3040 ≈ 3150×3000 mm; VMF-K6555 ≈ 3200×3300 mm