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Critical dimension measuring system NEXIV VMZ-S
field of view (FOV)distancecoordinate

Critical dimension measuring system - NEXIV VMZ-S - Nikon Metrology - field of view (FOV) / distance / coordinate
Critical dimension measuring system - NEXIV VMZ-S - Nikon Metrology - field of view (FOV) / distance / coordinate
Critical dimension measuring system - NEXIV VMZ-S - Nikon Metrology - field of view (FOV) / distance / coordinate - image - 2
Critical dimension measuring system - NEXIV VMZ-S - Nikon Metrology - field of view (FOV) / distance / coordinate - image - 3
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Characteristics

Measured physical value
dimensional, distance, coordinate, critical dimension, field of view (FOV)
Technology
optical, vision, camera-based, white light, laser, video
Operating mode
automatic, automated, continuous
Measured material
for turned parts, for wafers, for semiconductors
Applications
for industrial applications, for production lines, for quality control
Other characteristics
high-precision, non-contact, high-speed, high-resolution, configurable

Description

Product overview
Nikon's NEXIV VMZ-S series video measuring systems provide precise dimensional and height inspection for industrial micro‑measurement tasks. The series includes three measuring envelopes (VMZ-S3020, VMZ-S4540, VMZ-S6555) and a choice of six optical zoom/head types, with TTL (through‑the‑lens) scanning laser autofocus as standard.

Speed and accuracy
  • TTL scanning laser autofocus supports high‑speed height scanning up to 1,000 points/sec for fast surface profiling.
  • Minimum readout 0.01 µm and laser AF repeatability 2σ ≤ 0.5 µm ensure traceable dimensional measurements.
  • Designed for continuous inspection workflows with automatic measurement tolerant of component positioning variations.


Product highlights
  • Six optical zoom types (Type 1, 2, 3, 4, TZ, A) covering wide fields of view and high magnifications; Type 1–3 prioritize low distortion and high NA, Type 4 and TZ support high magnification.
  • 8‑segment ring illuminator with up to three incident angles (white LED) for improved edge capture; Type‑specific illumination options include episcopic, diascopic and darkfield.
  • Capability to detect thin transparent layers (~0.1 mm) using TTL laser AF (not available for Type A).
  • Imaging probe and probing options with low probing errors for fine feature measurement (P_FV2D,MPE 0.3 µm; P_F2D,MPE 0.8 µm).


Core features
  • High‑accuracy, high‑speed dimensional measurement across multiple magnifications with high‑NA optics.
  • Flexible illumination strategies and special options to measure difficult edges and complex features reliably.
  • Black & white or color 1/3" CMOS camera options and seamless optical zoom for observation and measurement workflows.
  • Integration with Nikon measurement software and optional SDKs for automation and data handling.


Specifications (summary)
Model | VMZ-S3020 | VMZ-S4540 | VMZ-S6555
XYZ strokes | 300 × 200 × 200 mm (TZ low‑mag: 250 × 200 × 200 mm) | 450 × 400 × 200 mm (TZ low‑mag: 400 × 400 × 200 mm) | 650 × 550 × 200 mm (TZ low‑mag: 600 × 550 × 200 mm)
Minimum readout | 0.01 µm (all models)
Maximum sample weight | 20 kg (accuracy guaranteed: 5 kg) | 40 kg (accuracy guaranteed: 20 kg) | 50 kg (accuracy guaranteed: 30 kg)
Maximum permissible error (MPE) | EUX/EUY, MPE = 1.2 + 4L/1000 µm; EUXY, MPE = 2.0 + 4L/1000 µm; EUZ, MPE = 1.2 + 5L/1000 µm
Probing error | P_F2D,MPE = 0.8 µm; P_FV2D,MPE = 0.3 µm
Camera | Black & White / Color 1/3" CMOS
Working distance | Type 1–3: 50 mm; Type 4: 30 mm; Type TZ: (high‑mag) 11 mm / (low‑mag) 32 mm; Type A: 73.5 mm (63 mm with Laser AF)
Laser AF repeatability | 2σ ≤ 0.5 µm
Illumination | Episcopic, diascopic, 8‑segment ring with multiple incident angles (white LED); type‑dependent configurations including darkfield
Power / consumption | AC100–240 V, 50/60 Hz / 2–4 A
Dimensions & weight | See model entries above (main body and controller dimensions/weights).

Technical specifications
  • Series: NEXIV VMZ‑S (VMZ‑S3020, VMZ‑S4540, VMZ‑S6555).
  • Minimum readout resolution: 0.01 µm.
  • TTL scanning laser autofocus: up to 1,000 points/sec height scanning; repeatability 2σ ≤ 0.5 µm.
  • Probing accuracy: imaging probe P_FV2D,MPE 0.3 µm; probing P_F2D,MPE 0.8 µm.
  • Illumination: episcopic, diascopic, segmented ring illuminator (multi‑angle), white LED; darkfield options for selected types.
  • Camera: 1/3" CMOS (BW or color).
  • Power: AC100–240 V, 50/60 Hz; nominal consumption 2–4 A depending on configuration.
  • Physical footprints and mass vary by model; consult model‑specific dimensions for installation planning.
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.