wafer metrology system
Atlas® III+

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wafer metrology system wafer metrology system - Atlas® III+
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Characteristics

  • Type:

    for wafers

Description

The Atlas III+ thin film and OCD system is latest generation metrology tool for leading-edge 3D device manufacturing.

Product Overview

By extending metrology performance to sub-angstrom precision and accuracy levels, the Atlas III+ system enables advanced process control across a broad range of applications in high volume manufacturing. The Atlas family of products incorporate a proprietary spectroscopic reflectometry and spectroscopic ellipsometry solution, and when combined with Onto Innovation’s industry leading Spectraprobe™ and NanoDiffract® OCD analysis software, enable process control of every critical manufacturing unit operation. The Atlas III+ system and NanoDiffract solution provides insight of complex structure profiles across etch, clean, deposition and CMP steps.

Applications

Gen5 and Gen6 3D-NAND
DRAM: 1Z – 1X nm
Logic and Foundry: 1X nm and below