Electrolytic copper plating

steelaluminumbrass

Copper Plating is electrolytic plating that deposits a layer of copper onto the substrate. This process is typically used to provide an anti-seize surface, as a mask to prevent carburizing on surfaces during heat treating, and to enhance solderability. Copper plating can be used as an under plate for difficult to plate alloys as well as electromagnetic shielding. Standard Specifications RoHS, REACH, ELV & WEEE Compliant Performance Benefits Good Solderability Excellent Conductivity Good corrosion when used as undercoat Inhibits electromagnetic interference with thickness of 1 mil of plating Throws very well Thickness .0001"-.001" 100-1000 uin. Max Part Size 24" x 20" x 12" 35 pounds per part