Cutting machine for the semiconductor industry GC-SEDW812

diamond wirefor monocrystalline siliconbar

Product Introduction
The GC-SEDW812 is a diamond-wire slicing machine designed to cut semiconductor single-crystal silicon rods into wafers. It supports silicon rod diameters compatible with 8" and 12" formats and a maximum processing length of 450 mm (crystal orientation deviation ≤ 4°). The unit reduces silicon material loss, provides high surface and dimensional quality, delivers efficient cutting throughput and stable operation for production environments.

Product Parameters
Max. workpiece size: φ301 × L450 × 1 (crystal orientation deviation ≤ 4°) mm
Incoming direction: one-way incoming / two-way incoming
Max. wire speed: 2100 m/min
Cutting method: downwards cutting
Cutting speed: 0–3 mm/min
Fast forward / rewind: 30–500 mm/min
Max. wire reserve: 50 km
Equipment size (L×W×H): approx. 6000 × 2600 × 3000 mm
Equipment weight: approx. 14,000 kg

Features / technical specifications

• Processing compatibility: silicon rods compatible with 8" and 12"
• Maximum processing length: 450 mm (crystal orientation deviation ≤ 4°)
• Cutting method: downwards cutting
• Maximum wire speed: 2100 m/min
• Cutting speed range: 0–3 mm/min
• Fast forward / rewind speed: 30–500 mm/min
• Maximum wire reserve: 50 km
• Workpiece incoming direction: one-way or two-way incoming
• Equipment dimensions (L×W×H): approx. 6000 × 2600 × 3000 mm (including cantilever box)
• Equipment weight: approx. 14,000 kg
• Benefits: low silicon material loss, high cutting quality, high efficiency and stable operation for production use