Cutting machine for the semiconductor industry GC-SEWS824

diamond wirefor monocrystalline siliconsample

Product Introduction
This equipment is designed for cutting semiconductor monocrystalline silicon rods. It accepts rod diameters from 8 to 24 inches (φ200–φ600 mm) and a maximum processing length of 2600 mm. The system uses diamond wire for cutting, head/tail removal and sample cutting, providing efficient cutting and consistent section quality.

Key features

• Diamond wire cutting suitable for monocrystalline silicon rods
• Functions: rod cutting, head/tail removal and sample slicing
• Compatible diameters: 8–24 in (φ200–φ600 mm); supports lengths up to 2600 mm
• Single-piece processing; segment length 150–400 mm (manual operation for segments below 300 mm)
• Cutting wire diameter φ0.42 mm and adjustable tension range 0–120 N

Product Parameters
Machine profile | Equipment Size | About 5000mm×2560mm×2740mm (L×W×H)
Equipment profile | Equipment Weight | About 5500kg
Specification of silicon rod | Length of Silicon Rod | 300–2000mm (excluding head/tail; cutting from head to tail without reversing)
Specification of silicon rod | Diameter of Silicon Rod | φ200–φ600mm
Specification of silicon rod | Processing Quantity | 1 piece/block
Specification of silicon rod | Segment Length | 150mm–400mm (manual cutting for those below 300mm)
Specification of silicon rod | Number of Cutting | 1 Knife edge/knife
Specification of silicon rod | Sample Thickness | 2–15mm
Cutting system | Feeding Drive | Servo motor, lead screws lifting
Cutting system | Moving Speed of Cutting Head | 0–900mm/min, stepless adjustment
Cutting system | Cutting Feed Speed | 0–20mm/min (set based on diameter of silicon rod)
Cutting system | Diameter of Cutting Wire | φ0.42mm
Cutting system | Cutting Time | Complete one cut of 18” silicon rod within about 90 minutes on average (adjustable)
Cutting tension | Tension of Cutting Wire | 0–120N
Equipment system | Power Supply for bus | 380V±10% AC, 50Hz±1Hz
Equipment system | Power Load | 14KVA

Technical specifications

• Model: GC-SEWS824
• Application: Cutting semiconductor monocrystalline silicon rods (diamond wire cutting, head/tail removal, sample cutting)
• Processing diameter range: 8–24 inches (φ200–φ600 mm)
• Processing length: up to 2600 mm (standard rod length support 300–2000 mm)
• Equipment size (approx.): 5000mm × 2560mm × 2740mm (L×W×H)
• Equipment weight (approx.): 5500kg
• Processing quantity: 1 piece/block
• Segment length: 150–400 mm (manual for <300 mm)
• Sample thickness: 2–15 mm
• Feeding drive: Servo motor with lead screws lifting
• Cutting head moving speed: 0–900 mm/min (stepless)
• Cutting feed speed: 0–20 mm/min (adjustable)
• Cutting wire diameter: φ0.42 mm
• Cutting wire tension: 0–120 N
• Average cutting time: ~90 minutes for one cut of 18” silicon rod (adjustable)
• Power supply: 380V±10% AC, 50Hz±1Hz
• Power load: 14 KVA