Product OverviewFC-1004 is a water-based silicon wafer cutting fluid developed and produced by Gaoce for multi-wire diamond slicing processes. It is circulated and sprayed into the slicing zone to provide lubrication and cooling, to flush and disperse si-kerf particles, and to stabilize cutting conditions. In production, FC-1004 helps increase overall slice yield (notably A-grade wafer yield), reduce diamond wire breakage, and improve flatness (TTV) and saw-mark performance while remaining safe and environmentally compliant (RoHS, REACH).
Product Parameters (Physical and Chemical Indicators)Item: Physical and Chemical Indicator
Appearance (original solution): Colorless to pale yellow transparent liquid
Cloud point (original solution): 45 - 48 ℃
COD value (original solution): 900,000 to 1.2 million ppm
Density (original solution, 25 ℃): 0.99 - 1.03 g/mL
Volatile content (original solution): 53.0 - 57.0 %
pH value (1 wt%, 25 ℃): 6.0 - 6.4
Conductivity (1 wt%, 25 ℃): ≤40 μS/cm
Static surface tension (0.2 wt%, 25 ℃): 28 - 31 mN/m
Characteristics / Technical specifications- Primary use: water-based additive for multi-wire slicing in silicon wafer manufacturing.
- Functions: lubrication, cooling, cleaning and dispersing of si-kerf particles to maintain cutting stability.
- Benefits: increases slicing yield (especially A-grade yield), reduces diamond wire breakage, improves TTV and reduces saw marks.
- Application method: supplied as a concentrate/original solution and sprayed into the slicing area via circulation piping.
- Appearance and handling: colorless to pale yellow transparent liquid; easy to handle in standard circulation systems.
- Key physical/chemical indicators: cloud point 45–48 ℃; density 0.99–1.03 g/mL; volatile content 53.0–57.0 %; pH (1 wt%) 6.0–6.4; conductivity ≤40 μS/cm; static surface tension 28–31 mN/m.
- Environmental & wastewater: high COD in original solution (900,000–1.2M ppm) — requires appropriate wastewater management and treatment.
- Compliance: meets RoHS and REACH related standards and regulations.