Electric chamfering machine GC-TD804

deskprecisionfor wafers

Product Introduction
This machine is designed for edge chamfering of silicon carbide wafers. It is compatible with 4-, 6- and 8-inch wafers and supports OF surface processing. An optional NOTCH groove processing function is available. The system is configured with dual workstations to support continuous throughput and stable operation.

Product Parameters (table)
Host size and weight: 2,250 (L) * 1,650 (W) * 2,600 (H) mm; 3,000 kg
Wafer size: 4 / 6 / 8 in
Wafer thickness: 300 μm–1,500 μm
Workstation: Dual workstation
Wafer reference surface shape: OF / Notch (Notch optional)
Equipment size: 2,250 (W) * 1,650 (D) * 2,600 (H) mm
Grinding X/Y/Z axis accuracy: ±1 μm
Ceramic suction cup plane accuracy: ≤3 μm
Grinding table spindle axial and radial accuracy: ±1 μm
Grinding wheel spindle axial and radial accuracy: ±1 μm
Grinding wheel outer diameter: Φ202 mm
Grinding wheel mounting inner diameter: Φ30 mm
Grinding wheel thickness: 20 mm
Grinding wheel speed: 0–4,000 r/min (per customer requirement)
Notch grinding wheel speed: 0–100,000 r/min (per customer requirement)
Grinding wheel types: T, R, TT, RR, TR, etc.
Wafer thickness measurement (non-contact or contact): repeatability ±2 μm; measurement point: center
Cleaning method: rotational cleaning
Drying method: centrifugal drying
Loading/unloading section: boxes: 4; slots: 25 (adjustable)

Features / Technical Specifications

• Application: chamfering for silicon carbide wafers, compatible with 4/6/8 in
• Optional functions: OF surface processing, NOTCH groove processing (optional)
• Dual workstation layout to support continuous loading/unloading
• Precision: X/Y/Z axis accuracy ±1 μm; ceramic suction cup flatness ≤3 μm
• Grinding wheel: Ø202 mm outer diameter, Ø30 mm mounting bore, 20 mm thickness
• Speed ranges configurable: grinding wheel 0–4,000 r/min; Notch wheel up to 100,000 r/min
• Thickness measurement: center point, repeatability ±2 μm
• Process supports rotation cleaning and centrifugal drying for post-grind cleaning
• Loading/unloading: 4 boxes with 25 adjustable slots