Grinding machine with rotary table GC-BG202H

manualautomatichigh-precision

Product introduction
This series grinder is designed for thinning hard and brittle materials. It uses an in-feed grinding principle: the rotating wafer is ground by a rotating grinding wheel with vertical feed. The GC-BG202H is optimized for high rigidity and is suitable for efficient, high-precision processing of silicon carbide wafers as well as conventional silicon wafers.

Product parameters
Wafer sizes supported: 8 inch, 6 inch
Wafer thickness range: 0.1 mm – 1 mm
Grinding principle: In-feed
Grinding wheel size: 12 inch (300 mm)
Grinding mode: Auto / Manual
Material box quantity: 2 (compatible with 8" and 6")
Processing sides: Single- or double-sided thinning (programmable selection)
Weight: 9500 KG
Dimensions (L×W×H): 3050 × 1495 × 2180 mm

Related products

• GC-SCDW8300 Silicon carbide slicing machine
• GC-TD804 Silicon carbide chamfering machine
• GC-BG202H Automatic thinning grinder

Features / Technical specifications

• Intended materials: hard and brittle materials, especially silicon carbide wafers and silicon wafers
• Wafer sizes: 8 inch, 6 inch
• Processing thickness range: 0.1 mm – 1 mm
• Grinding wheel: 12 inch (300 mm)
• Grinding principle: In-feed; modes: automatic or manual
• Spindles: 2 (Z1, Z2) with air bearings
• Spindle motor power: 11 KW; spindle speed: 1000–3000 rpm (Z1/Z2 adjustable independently)
• Z-axis travel: 150 mm; resolution / minimum move: 0.1 μm
• Z-axis speed: 0.0001–0.08 mm/s; maximum speed 50 mm/s
• Wafer tables: 3 (A, B, C) with air bearings and vacuum adsorption
• Wafer table speed: 0–500 rpm (individually settable)
• Wafer table switching: air turntable
• Table cleaning methods: oilstone, two-fluid, brush
• Material boxes: 2 (compatible with 8" and 6")
• Weight: 9500 KG; Dimensions: 3050 × 1495 × 2180 mm