Hot air rework station EA-A20

automaticfor BGA

1. High automation, one-touch for rework, soldering, pick-up and placement of chip, easy operation. 2. Large power brushless DC fan, closed loop sensor, microcomputer zero trigger control, large volume air with constant temperature. No need of external air source, flexible application. 3. Seven-phase temperature zone, can be used for light-reflecting BGA, multi-layer BGA and metallic shielding case, POP. 4. Integrated design, the heating and alignment systems integrate well. 5. Dichromatic optical prism alignment, joystick control. 6. Transverse flow fan, air speed controllable, cool down bottom heating area and PCB as per process requirement. 7. QUICKSOFT interface, operation access and profile analysis functions available, can analyze preheating speed, peak temperature, temperature holding time and cooling rate effectively 8. Various nozzles, easy replacement. Model EA-A20 General power 6600 W(Max) Power supply 220V AC 50HZ Hot air heating temperature 400°C(Max) Bottom preheating temperature 400°C(Max) Power of top heater(hot air) 1200W Power of bottom heater(infrared preheating) 1600 W Hot air flow 60 L/S Bottom radiation preheating size 550 mm *450 mm Max. circuit board size 600 mm *650 mm Chip size range 2*2 mm – 60* 60 mm Placement accuracy ± 0.02mm Placement force 1.5 N / zero pressure mounting (two modes) Adjustable air speed of side cooling fan ≤35m3／min Camera 36*12 times magnifying Horizontal resolution 500 lines