Automatic rework station 3000

for BGA

1. Based on the principle of dark infrared heating, the equipment has closed-loop temperature control, precise and stable temperature and small fluctuation. With dark infrared ceramic plate heating at the bottom and high-infrared heating tube at the top, it has an extremely long service life. It minimizes the lateral temperature difference of B G A to prevent cold soldering or overheating damage of BGA. 2. Designed with an observation window, allowing real-time observation for the melting of the BGA chip solder ball, and the BGA in different specifications soldered simultaneously. 3. A sound and light alarm is provided when the heating cabinet is opened during soldering. 4. When the cabinet is opened after the process ends, the cooling fan works automatically; when the cabinet is closed, the cooling fan also stops working. 5. The panel is equipped with an external K-type sensor to monitor the actual temperature of BGA. Top Heating Power 500W Bottom heating power 400W Temperature Range 50℃ - 300℃ Process Parameters 10 Heating Zone Size 130 * 130mm Overall Dimensions 355* 225* 180mm