Hot air rework station EA-A10

automaticfor BGA

1.The middle area of the top and bottom is heated up and down by hot air, and the large area of infrared preheating at the bottom. 2.The split image prism is used for alignment so that the alignment is visual and efficient. 3.With soldering height, placement height, position height memory function, the alignment and placement is efficient. 4.With a number of titanium alloy hot air nozzle, the replacement is rapid. 5.Adjustable cooling fan can cool the heating zone and PCB according to process requirements. General Power 4500W（max） Power Supply 220V/AC 50HZ Power of Top Heater(hot air) 1200W Power of Bottom Heater(hot air) 1200W Power of Bottom Heater(Infrared Preheating) 1600W Adjustable Air Speed of Side Cooling Fan ≤3.5 m3/min Hot Air Heating Temperature 400°C(Max) Bottom Preheating Temperature 400°C(Max) Bottom Preheating Size 400mm*400mm Max. PCB Size 420mm*450mm Chip Size Range 2*2mm ~ 60*60mm Placement Accuracy ±5mm Placement Force 1.5 N / Zero Pressure Mounting (two modes) Camera 12V/300mA； 22*10 times magnifying; horizontal resolution 480 lines PAL (phase alternation line) format LED Lighting Top blue light source and bottom orange light source (luminance adjustable) Communication USB(can be connected with PC) External K-type Sensor 5 channels Net Weight About 70KG Overall Dimensions (L *W *H) 810(L)mm × 675(W)mm × 835 (H)mm