COM Express computer-on-module PN-SOM-COMe-BT6-PTL

Intel® Core™ Ultra2.5 GbEUSB Type-C

Product overview
COM Express Rel. 3.1 Type 6 module SOM-COMe-BT6-PTL based on Intel® Core™ Ultra Series 3 processors (codename: Panther Lake-H). Designed for embedded systems requiring high compute, integrated graphics, on-board AI acceleration and broad I/O options.

Highlights

• CPU: Intel® Core™ Ultra Series 3 processors with embedded Intel NPU5 (50 TOPS), up to 180 platform TOPS
• Graphics: Integrated Intel® Graphics up to 12 3rd Gen Xe cores; IPU 7.5 for advanced imaging
• Memory: 2x DDR5 SO-DIMM slots (DDR5-5600) supporting up to 96 GB
• Connectivity: 1x NBase-T (2.5 GbE); up to 2x USB4 40 Gbps; up to 4x Superspeed USB 10 Gbps; up to 20 PCIe lanes

Key capabilities

• Support for multiple CPU SKUs within Intel® Core™ Ultra Series 3 family (X9, X7, 9, 7, 5 variants)
• Advanced imaging and AI: IPU 7.5 for concurrent camera streams and up to 50 TOPS NPU5
• Multi-display and high video throughput: up to four independent displays at up to 4K120Hz
• Platform manageability: Secure Boot, OTA update support and device monitoring

Technical details

• Description: COM Express Rel. 3.1 Type 6 module with Intel® Core™ Ultra Series 3 processors (Panther Lake-H)
• CPU Description: Intel® Core™ Ultra X9 Series 3; Intel® Core™ Ultra X7 Series 3; Intel® Core™ Ultra 9 Series 3; Intel® Core™ Ultra 7 Series 3; Intel® Core™ Ultra 5 Series 3
• Memory Description: 2x DDR5-5600 SO-DIMM slots, up to 96 GB
• Graphics Description: Integrated Intel® Graphics up to 12 3rd Gen Xe cores; support for up to 4 independent displays; IPU 7.5 for 3x concurrent camera management
• Video interfaces: 2x Type-C (DP/DP Alt Mode over Type-C, HDMI, DP tunneled); 1x DDI (DP 2.1 2-lane/4-lane option); 1x eDP 1.5 (max 4K120Hz HDR) or LVDS alternative
• Mass storage: Optional onboard NVMe SSD soldered up to 1 TB (PCIe x4); optional 2x SATA (commercial modules)
• Networking: 1x NBase-T via Intel® I226 (2.5GbE) with TSN support
• USB: Up to 2x USB4 40 Gbps; up to 4x Superspeed USB 10 Gbps; 8x Hi-Speed USB
• PCIe: Up to 8 PCIe Gen4 lanes; optional PEG x8 Gen5 (depending on CPU); optional PEG x4 Gen4
• Audio & serial: HD Audio interface; SoundWire; 2x 2-wire UARTs
• Other I/O: Optional 2x MIPI-CSI 4-lane; SPI; 2x I2C; SMBus; thermal and fan management; eSPI or LPC options; optional TPM 2.0; GPIOs; watchdog
• Power: Main +12 VDC ±10%; Aux +5VSB, +3VRTC
• OS support: Microsoft® Windows 11 IoT Enterprise 2021 LTSC; Clea OS
• Operating temperature: Commercial 0°C to +60°C; Industrial -40°C to +85°C
• Dimensions: 125 x 95 mm (COM Express® Basic form factor, Type 6 pinout)

Security and management

• Built-in Secure Boot for platform integrity from first startup
• OTA updates for secure remote software distribution
• Device monitoring and Clea-based security monitoring, patching and update automation
• Yocto-based secure OS integration options and compliance-oriented design

Resources

• Datasheet, technical documentation and developer resources available on the product page

Technical specifications

• Model: SOM-COMe-BT6-PTL
• Form factor: COM Express Rel. 3.1 Type 6 (125 x 95 mm)
• CPU family: Intel® Core™ Ultra Series 3 (multiple SKUs)
• NPU: Intel NPU5 50 TOPS (platform up to 180 TOPS)
• Memory: 2x DDR5 SO-DIMM DDR5-5600, up to 96 GB
• Graphics: Integrated Intel® up to 12 3rd Gen Xe cores; IPU 7.5
• Video I/O: 2x Type-C DP/Alt Mode, DDI DP2.1 option, eDP 1.5 / LVDS alternatives
• Storage: NVMe onboard up to 1 TB (PCIe x4); optional SATA
• Networking: Intel® I226 NBase-T 2.5GbE with TSN
• USB: USB4 up to 40 Gbps, Superspeed 10 Gbps ports, Hi-Speed USB ports
• PCIe: up to 8 lanes Gen4; optional PEG x8 Gen5 / PEG x4 Gen4
• Security: optional TPM 2.0, Secure Boot
• Power: Main +12 VDC ±10%; Aux +5VSB, +3VRTC
• OS: Windows 11 IoT Enterprise 2021 LTSC; Clea OS
• Operating temperature: 0°C to +60°C (commercial); -40°C to +85°C (industrial)